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Intel Arc A770M

Intel A770M

The Intel Arc A770M is a dedicated mobile lower- mid-range graphics card for laptops based on Xe HPG microarchitecture. It uses the ACM-G10 chip and offers all of the 32 Xe-cores (512 ALUs), 32 ray tracing units and a 256-bit memory bus for 12 GB GDDR6 graphics memory. The chip can clock from 300 MHz (low frequency mode) to 1650 MHz (high frequency) or in short bursts 2050 MHz (Turbo). The chip integrates 21.7 billion transistors, uses a BGA2660 package (soldered), and the die measures 406 mm2.

The performance of the Arc A770M is not yet known. The power consumption is similar to a RTX 3070 and therefore we see the performance slightly below a RTX 3070 mobile.

The chip also integrates two media engines for VP9, AVC, HEVC, and AV1 8k en- and decoding. The 4 display pipes support up to 4x 4k120 HDR via DMI 2.0B or DisplayPort 2.0 10G. 

The A770M is produced in 6nm at TSMC (N6 process) and supports dynamic power share (using Deep Link) with 12th gen Intel CPUs (Alder Lake).

Arc Series

Arc B580 compare 2560 @ 2.67 - 2.67 GHz192 Bit @ 19000 MHz
Arc A770 compare 4096 @ 2.1 - 2.4 GHz256 Bit @ 16000 MHz
Arc A750 compare 3584 @ 2.05 - 2.4 GHz256 Bit @ 16000 MHz
Arc A580 compare 3072 @ 1.7 - 2 GHz256 Bit @ 16000 MHz
A770M 4096 @ 1.65 GHz256 Bit @ 16000 MHz
A730M compare 3072 @ 1.1 GHz192 Bit @ 14000 MHz
A570M compare 16 @ 0.9 - 1.3 GHz128 Bit @ 14000 MHz
A550M compare 16 @ 0.9 - 2.01 GHz128 Bit @ 14000 MHz
A530M compare 12 @ 0.9 - 1.3 GHz128 Bit @ 14000 MHz
A370M compare 8 @ 1.55 GHz64 Bit @ 14000 MHz
Arc A380 compare 1024 @ 2 GHz96 Bit @ 15500 MHz
A310 compare 6 @ 2 GHz64 Bit @ 15500 MHz
A350M compare 6 @ 1.15 GHz64 Bit @ 14000 MHz
CodenameAlchemist
ArchitectureXe HPG
Pipelines4096 - unified
Raytracing Cores32
Core Speed1650 MHz
CacheL1: 6 MB, L2: 16 MB
Memory Speed16000 MHz
Memory Bus Width256 Bit
Memory TypeGDDR6
Max. Amount of Memory16 GB
Shared Memoryno
Memory Bandwidth512 GB/s
APIDirectX 12_2, OpenGL 4.6, Vulkan 1.3
Power Consumption150 Watt (120 - 150 Watt TGP)
Transistor Count21.7 Billion
Die Size 406 mm²
technology6 nm
PCIe4 16x
Displays4 Displays (max.), HDMI 2.0b, DisplayPort 2.0 10G Ready
Notebook Sizelarge
Date of Announcement30.03.2022
Link to Manufacturer Pageark.intel.com

Benchmarks

Performance Rating - 3DMark 11 + Fire Strike + Time Spy
9.6 pt (29%)
3DMark Vantage
3DM Vant. Perf. total +
3DM Vant. Perf. GPU no PhysX +
3DMark 06 3DMark 06 - Standard 1280x1024 +
SPECviewperf 12
specvp12 sw-03 +
specvp12 snx-02 +
specvp12 showcase-01 +
specvp12 mediacal-01 +
specvp12 maya-04 +
specvp12 energy-01 +
specvp12 creo-01 +
specvp12 catia-04 +
specvp12 3dsmax-05 +
SPECviewperf 13 specvp13 sw-04 +
specvp13 snx-03 +
specvp13 showcase-02 +
specvp13 medical-02 +
specvp13 maya-05 +
specvp13 energy-02 +
specvp13 creo-02 +
specvp13 catia-05 +
specvp13 3dsmax-06 +
SPECviewperf 2020 specvp2020 solidworks-05 4k +
specvp2020 snx-04 4k +
specvp2020 medical-03 4k +
specvp2020 maya-06 4k +
specvp2020 energy-03 4k +
specvp2020 creo-03 4k +
specvp2020 catia-06 4k +
specvp2020 3dsmax-07 4k +