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AMD Ryzen AI 7 350 | AMD Radeon 860M | 14.00" | 1.2 kg
The AMD Ryzen AI 7 350 is a powerful mobile processor from the Krackan Point family that was announced at CES in early 2025. The APU integrates 8 CPU cores (4x Zen 5 with up to 5 GHz and 4x Zen 5c with less cache and a maximum of 3.5 GHz) and a big 16 MB L3-Cache.
Architecture and features
The Krackan Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores located in separate clusters, the latter being a slightly slower, smaller and more energy efficient version of the former. One of the differences between Zen 5 and Zen 5c is the size of the cache; the Zen 5 cores have larger caches available.
However, the mobile Zen 5 implementation is reportedly (ChipsAndCheese) is closer to desktop Zen 4 than desktop Zen 5 due to the different cache sizes, large differences in AVX-512 throughput, and other factors.
Elsewhere, the Ryzen AI 7 chip supports DDR5-5600 and LPDDR5x-8000 RAM, giving system designers a choice between lower latency and higher throughput. The chip is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors. The integrated XDNA 2 NPU, which is much more complex than the first generation XDNA, delivers up to 50 INT8 TOPS for accelerating various AI workloads.
As usual with laptop CPUs, the Ryzen 7 AI chip cannot be replaced by the user as it is soldered.
Performance
Thanks to the Zen 5 architecture and the high clock rates, the CPU performance should be very good.
Graphics
The Radeon 860M is the direct successor to the Radeon 760M and offers 8 cores (CUs = 512 shaders) and clocks at up to 3 GHz. It uses the new RDNA 3.5 architecture.
Power consumption
The AI 350 is said to have a base TDP of 28 W, although laptop manufacturers are free to set the TDP between 15 and 54 W.
The 4 nm TSMC process with which these CPUs are manufactured ensures above-average energy efficiency.
Codename | Krackan Point (Zen 5) |
Clock Rate | 2000 - 5000 MHz |
Level 2 Cache | 8 MB |
Level 3 Cache | 16 MB |
Number of Cores / Threads | 8 / 16 4 x 5.0 GHz AMD Zen 5 4 x 3.5 GHz AMD Zen 5c |
Power Consumption (TDP = Thermal Design Power) | 28 Watt |
TDP Turbo PL2 | 54 Watt |
Manufacturing Technology | 4 nm |
Socket | FP8 |
Features | DDR5-5600/LPDDR5x-8000 RAM, PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), Secure Processor, SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A |
GPU | AMD Radeon 860M ( - 3000 MHz) |
NPU / AI | 50 TOPS INT8 |
Chip AI | 66 TOPS INT8 |
64 Bit | 64 Bit support |
Architecture | x86 |
Announcement Date | 01/06/2025 |
Product Link (external) | www.amd.com |
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