The HiSilicon Kirin 820e is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced 2022 and contains 8 processor cores. One fast ARM Cortex-A76 core with up to 2.22 GHz, three addition A76 cores at up to 2 and four efficiency Cortex-A55 cores at up to 1.84 GHz. Furthermore, the SoC integrates a 5G modem and a fast mid-range ARM Mali-G57 MP6 graphics card. For AI acceleration, the Kirin 820 integrates a DaVinci NPU. Compared to the similar named Kirin 820, the 820e offers slower clocked CPU cores on a level with the older Kirin 810.
The chip should also integrate Bluetooth 5 and WiFi 6.
The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.
| Codename | Cortex-A76/-A55 |
| Clock Rate | 1840 - 2220 MHz |
| Number of Cores / Threads | 8 / 8 |
| Manufacturing Technology | 7 nm |
| Features | ARM Mali-G52 MP6 GPU, 1x Cortex-A76 up to 2.22 GHz, 3x A76 nup to 2.2 GHz, 4x A55 up to 1.84 GHz, big.LITTLE, 5G TDD/FDD, Bluetooth 5, WiFi 6, AGPS, Glonass, Baidou |
| GPU | ARM Mali-G57 MP6 |
| 64 Bit | 64 Bit support |
| Architecture | ARM |
| Announcement Date | 03/31/2020 |
| Product Link (external) | www.hisilicon.com |
- Average benchmark values
Huawei MatePad Paper: ARM Mali-G57 MP6, 10.30", 0.4 kg
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