
Motorola Edge 30 Fusion smartphone review - Not high-end, but really good
Qualcomm Snapdragon 888 Plus 5G | Qualcomm Adreno 660 | 6.55" | 172 g
The Qualcomm Snapdragon 888+ (Plus) 5G Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2021 and manufactured in 5 nm at Samsung.
Integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 3 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 5G is now included in the chip with the Snapdragon X60 modem.
Compared to the older Snapdragon 888, the 888+ offers a slightly higher clocked prime core (+160 MHz) and a 23% faster Hexagon 790 DSP. Therefore, it is now the fastest Android SoC (at the time of announcement), but still slightly slower (CPU and GPU) than the Apple A14 and A15 Bionic SoCs.
Codename | Cortex-X1 / A78 / A55 (Kryo 680) | ||||||||||||||||
Series | Qualcomm Snapdragon | ||||||||||||||||
Series: Snapdragon Cortex-X1 / A78 / A55 (Kryo 680)
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Clock Rate | 1800 - 3000 MHz | ||||||||||||||||
Level 3 Cache | 3 MB | ||||||||||||||||
Number of Cores / Threads | 8 / 8 1 x 3.0 GHz ARM Cortex-X1 3 x 2.4 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | ||||||||||||||||
Power Consumption (TDP = Thermal Design Power) | 5 Watt | ||||||||||||||||
Manufacturing Technology | 5 nm | ||||||||||||||||
Features | Adreno 660 GPU, Spectra 580 ISP, Hexagon 780, X60 5G Modem, FastConnect 6900 WiFi, LPDDR5-6400 (3200 MHz) Memory Controller (64 Bit) | ||||||||||||||||
GPU | Qualcomm Adreno 660 | ||||||||||||||||
64 Bit | 64 Bit support | ||||||||||||||||
Architecture | ARM | ||||||||||||||||
Announcement Date | 06/28/2021 | ||||||||||||||||
Product Link (external) | www.qualcomm.com |
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