
Realme C3 smartphone review – Rock-bottom pricing with charm
Mediatek Helio G70 | ARM Mali-G52 MP2 | 6.50" | 195 g
The Mediatek Helio G70 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and integrates 8 CPU cores. Two fast ARM Cortex-A75 cores with up to 2 GHz for performance tasks and six small ARM Cortex-A55 with up to 1.7 GHz for efficiency. All eight cores can be used together thanks to Heterogeneous Multi-Processing support. The integrated GPU is a ARM Mali-G52 MC2 (MP2) with two clusters at up to 820 MHz. The SoC also integrates the HyperEngine that handles a dynamic management of CPU, GPU and memory.
Compared to the slightly faster Helio G80, the difference to the G70 is the slightly lower clock speed for the A55 cores (-100 MHz) and GPU (-130 MHz).
The SoC integrates furthermore a LTE radio with Cat-7 (download) / Cat-13 (upload) support, Wifi 5 (ac), Bluetooth 5.0, LPDDR4x 1800 MHz and eMMC 5.1 storage.
Codename | Cortex-A75 / A55 | ||||||||||||||||||||||||
Series | Mediatek Mediatek Helio G | ||||||||||||||||||||||||
Series: Mediatek Helio G Cortex-A75 / A55
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Clock Rate | 2000 MHz | ||||||||||||||||||||||||
Number of Cores / Threads | 8 / 8 | ||||||||||||||||||||||||
Manufacturing Technology | 12 nm | ||||||||||||||||||||||||
Features | 4x ARM Cortex-A73, 4x ARM Cortex-A53, | ||||||||||||||||||||||||
GPU | ARM Mali-G52 MP2 ( - 820 MHz) | ||||||||||||||||||||||||
64 Bit | 64 Bit support | ||||||||||||||||||||||||
Architecture | ARM | ||||||||||||||||||||||||
Announcement Date | 04/18/2019 | ||||||||||||||||||||||||
Product Link (external) | www.mediatek.com |
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