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MagyarHiSilicon Kirin 810
The HiSilicon Kirin 810 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2019 and contains 8 processor cores. Two fast ARM Cortex-A76 cores with up to 2.27 GHz and six small power efficient ARM Cortex-A55 cores with up to 1.88 GHz (bigLITTLE). Furthermore, the SoC integrates a mid range graphics card called ARM Mali-G52 MP6 with 6 clusters. For AI acceleration, the Kirin 810 integrates a Ascend D100 Lite NPU (Da Vinci architecture). The integrates LTE modem supports Cat.12/13 with Dual Sim VoLTE. For photography, the Kirin 810 integrates the Kirin ISP4.0. The memory controller supports LPDDR4X at up to 2133 MHz. Furthermore, WiFi 802.11ac and Bluetooth 5.0 are integrated in the chip.
The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.
| Series | HiSilicon | ||||||||||||||||||||
| Codename | Cortex-A76/-A55 | ||||||||||||||||||||
| Series: Cortex-A76/-A55 |
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| Clock Rate | 1880 - 2270 MHz | ||||||||||||||||||||
| Number of Cores / Threads | 8 / 8 | ||||||||||||||||||||
| Manufacturing Technology | 7 nm | ||||||||||||||||||||
| Features | ARM Mali-G52 MP6 GPU, 2x Cortex-A76 (2.2 GHz) + 6x Cortex-A55 (1.88 GHz, big.LITTLE), LTE Cat-12 1400 Mbps Downlink, Cat-13 200 Mbps Uplink, Bluetooth 5, WiFi a/b/g/n/ac, AGPS, Glonass, Baidou | ||||||||||||||||||||
| GPU | ARM Mali-G52 MP6 | ||||||||||||||||||||
| 64 Bit | 64 Bit support | ||||||||||||||||||||
| Announcement Date | 06/01/2019 | ||||||||||||||||||||
- Average benchmark values for this graphics card