The MediaTek Dimensity 8300 presented in Q4 2023 is an ARM-based SoC (system-on-a-chip) that is manufactured using the 4 nm process. It was specially designed for use in Android smartphones and is in the lower upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. The only difference to the older Dimensity 8300 is the support for StarSpeed software.
The CPU works with a total of eight cores, which are divided into two clusters. The first cluster contains one ARM Cortex-A715 power core, which operates at up to 3.35 GHz. In addition, there are 3 further ARM Cortex-A715 cores with 3.2 GHz. The second cluster contains four ARM Cortex-A510 energy-saving cores with 2.2 GHz. LPDDR5 RAM can be used as RAM and UFS 4.0 is supported as internal memory.
In terms of connectivity, dual 5G with a theoretical peak download speed of up to 5.17 GBit/s is available, as well as WiFi 6E and Bluetooth 5.4.
An Imagiq 980 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps.
The integrated ARM Mali-G615 MC6 graphics unit can control displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.
| Codename | Cortex-A15 / A510 |
| Clock Rate | 2200 - 3350 MHz |
| Level 3 Cache | 4 MB |
| Number of Cores / Threads | 8 / 8 3.4 GHz 4 x 3.2 GHz ARM Cortex-A715 4 x 2.2 GHz ARM Cortex-A510 |
| Manufacturing Technology | 4 nm |
| Features | ARM Mali-G610 MC6 GPU, Dual 5G modem, WiFi 6E, Bluetooth 5.3, H.264/HEVC video decoding |
| GPU | ARM Mali-G615 MP6 |
| 64 Bit | 64 Bit support |
| Architecture | ARM |
| Announcement Date | 11/09/2024 |
| Product Link (external) | www.mediatek.com |
- Average benchmark values
Honor Pad V9: ARM Mali-G615 MP6, 11.50", 0.5 kg
External Review » Honor Pad V9
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