The HiSilicon Kirin 820 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2020 and contains 8 processor cores. One fast ARM Cortex-A76 core with up to 2.36 GHz, three addition A76 cores at up to 2.22 (as the old Kirin 810) and four efficiency Cortex-A55 cores at up to 1.88 GHz. Furthermore, the SoC integrates a 5G modem and a fast mid-range ARM Mali-G57 MP6 graphics card. For AI acceleration, the Kirin 820 integrates a DaVinci NPU.
The performance of the CPU part in our tests was slightly higher than the old Kirin 810 (thanks to the fast performance core). Huawei advertises 27% performance advantage for the CPU. The NPU and GPU have bigger performance gains with 73% and 38% more power.
The chip should also integrate Bluetooth 5 and WiFi 6.
The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.
| Series | HiSilicon | ||||||||||||||||||||||||
| Codename | Cortex-A76/-A55 | ||||||||||||||||||||||||
Series: Cortex-A76/-A55
| |||||||||||||||||||||||||
| Clock Rate | 1840 - 2360 MHz | ||||||||||||||||||||||||
| Number of Cores / Threads | 8 / 8 | ||||||||||||||||||||||||
| Manufacturing Technology | 7 nm | ||||||||||||||||||||||||
| Features | ARM Mali-G52 MP6 GPU, 1x Cortex-A76 up to 2.36 GHz, 3x A76 nup to 2.2 GHz, 4x A55 up to 1.84 GHz, big.LITTLE, 5G TDD/FDD, Bluetooth 5, WiFi 6, AGPS, Glonass, Baidou | ||||||||||||||||||||||||
| GPU | ARM Mali-G57 MP6 | ||||||||||||||||||||||||
| 64 Bit | 64 Bit support | ||||||||||||||||||||||||
| Architecture | ARM | ||||||||||||||||||||||||
| Announcement Date | 03/31/2020 | ||||||||||||||||||||||||
| Product Link (external) | www.hisilicon.com | ||||||||||||||||||||||||
- Average benchmark values for this graphics card
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