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MediaTek Dimensity 6100+ | ARM Mali-G57 MP2 | 6.50" | 217 g
The Mediatek Dimensity 6100+ (or 6100 Plus, MT6835V/ZA) is a lower mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). The specifications are similar to the old Dimensity 700 SoC and nearly identical to the Dimensity 6020. Compared to the 6020, the 6100+ offers slightly higher 5 G speeds (3.3 vs 2.7 Gbps), Bluetooth 5.2 (vs 5.1) support, and is manufactured in the slightly improved 6nm process (vs 7nm).
Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
Codename | Cortex-A76 / A55 | ||||||||||||
Series | Mediatek Dimensity 6000 | ||||||||||||
Series: Dimensity 6000 Cortex-A76 / A55
| |||||||||||||
Clock Rate | 2000 - 2200 MHz | ||||||||||||
Number of Cores / Threads | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | ||||||||||||
Manufacturing Technology | 6 nm | ||||||||||||
Features | 2x ARM Cortex-A76 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC2, APU 3.0, 5G Modem (2CC), MiraVision, Wi-Fi 5, Bluetooth 5.2, UFS 2.2, 16GB LPDDR4x Support | ||||||||||||
GPU | ARM Mali-G57 MP2 | ||||||||||||
64 Bit | 64 Bit support | ||||||||||||
Architecture | ARM | ||||||||||||
Announcement Date | 03/01/2023 | ||||||||||||
Product Link (external) | www.mediatek.com |
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