AMD E1-2100

The AMD E1-2100 is a mobile dual-core SoC for low-end subnotebooks and netbooks, which was presented in mid-2013. In addition to 2 CPU cores with a base clock speed of 1.0 GHz (no turbo), the 28-nanometer chip also integrates a Radeon HD 8210 GPU, a single-channel DDR3L-1333 memory controller as well as the Southbridge with various I/O- ports.

Architecture

Both Kabini (for notebooks) and Temash (tablets and compact subnotebooks) are based on AMD's new Jaguar architecture, which replaces the previous Bobcat models (e.g. the E-350). According to AMD, the performance per clock has been increased by about 15 percent. Furthermore, various modern instruction set extensions such as SSE up to version 4.2, AVX and AES are now supported. The finer 28-nanometer process from TSMC allows lower voltages and/or higher clock rates compared to Bobcat, as well as up to 4 CPU cores (Bobcat: 2 cores).

Performance

Due to the low clock speed of just 1.0 GHz, the performance is quite modest and similar to the old AMD C-60. For simple office and multimedia tasks, the E1-2100 has sufficient power; however, it will quickly reach its limits in more demanding applications and games.

Graphics

The SoC integrates a Radeon HD 8210 GPU with 128 shaders, which is based on the GCN architecture. The core is clocked at 300 MHz (no turbo). On average, the HD 8210 matches the Intel HD Graphics (Ivy Bridge). However, the performance is often limited by the CPU. Recent Games (as of 2013) are therefore hardly playable. Only a few older and less demanding games will run fluently.

Power Consumption

This AMD SoC has a 9 W TDP making it a good choice for ultra-compact laptops, cooled either actively or passively. The 28 nm node E1-2100 is built with makes for decent energy efficiency.

Series	AMD E-Series
Codename	Kabini
Series: E-Series Kabini AMD E2-3000 1.65 GHz 2 / 2  AMD E1-2500 1.4 GHz 2 / 2  AMD E1-2200 1.05 GHz 2 / 2  AMD E1-2100 « 1 GHz 2 / 2
Clock Rate	1000 MHz
Level 1 Cache	128 KB
Level 2 Cache	1 MB
Number of Cores / Threads	2 / 2
Power Consumption (TDP = Thermal Design Power)	9 Watt
Manufacturing Technology	28 nm
Features	SSE (1, 2, 3, 3S, 4.1, 4.2, 4A), x86-64, AES, AVX, DDR3L-1333
64 Bit	64 Bit support
Architecture	x86
Announcement Date	05/23/2013

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