The Intel Core i3-6100H is a dual-core processor based on the Skylake architecture, that has been launched in September 2015. In addition to two CPU cores with Hyper-Threading clocked at 2.7 GHz (no Turbo Boost), the chip also integrates an HD Graphics 530 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The CPU is manufactured using a 14 nm process with FinFET transistors.
Architecture
Skylake replaces both Haswell and Broadwell and brings the same microarchitecture in every TDP class from 4.5 to 45 W. The extensive improvements of the Skylake design include increased out-of-order buffers, optimized prefetching and branch prediction as well as additional performance gains through Hyper-Threading. Overall, however, performance per clock has been increased by only 5 to 10 percent (compared to Haswell) respectively under 5 percent (compard to Broadwell), which is quite modest for a new architecture ("Tock").
Furthermore, the organisation of the eDRAM cache has been modified. Instead of acting like a victim cache, which has to be adressed via the L3/LLC, the eDRAM can now be adressed directly by programms just like the main memory. The size is still 128 MB for the quad-core models (4C + GT4e), while the dual-core chips (2C + GT3e) only offer 64 MB.
Performance
According to the specified clock rates and the improved architecture, the Core i3-6100H performs similar to a Core i5-5300U (Broadwell, 15 W) or Core i7-4510U (Haswell, 15 W). Thus, the CPU has sufficient power for office and multimedia purposes as well as more demanding applications and multitasking.
Graphics
The integrated graphics unit called HD Graphics 530 represents the "GT2" version of the Skylake GPU (Intel Gen. 9). The 24 Execution Units, also called EUs, are clocked at 350 - 900 MHz and offer a performance about 20 percent above the old HD Graphics 4600. Games of 2015 can thus be played smoothly in low or medium settings. For more information about performance and features, check our page for the HD Graphics 530.
Power Consumption
Specified at a TDP of 35 W (including CPU, GPU and memory controller), the CPU is best suited for medium-sized notebooks (13-inches and above).
| Codename | Skylake | ||||||||||||||||||||
| Series | Intel Core i3 | ||||||||||||||||||||
Series: Core i3 Skylake
| |||||||||||||||||||||
| Clock Rate | 2700 MHz | ||||||||||||||||||||
| Level 1 Cache | 128 KB | ||||||||||||||||||||
| Level 2 Cache | 512 KB | ||||||||||||||||||||
| Level 3 Cache | 3 MB | ||||||||||||||||||||
| Number of Cores / Threads | 2 / 4 | ||||||||||||||||||||
| Power Consumption (TDP = Thermal Design Power) | 35 Watt | ||||||||||||||||||||
| Manufacturing Technology | 14 nm | ||||||||||||||||||||
| Die Size | 99 mm2 | ||||||||||||||||||||
| Max. Temperature | 100 °C | ||||||||||||||||||||
| Socket | BGA | ||||||||||||||||||||
| Features | Dual-Channel DDR3L-1600/DDR4-2133 Memory Controller, HyperThreading, AVX, AVX2, Quick Sync, Virtualization, AES-NI | ||||||||||||||||||||
| GPU | Intel HD Graphics 530 (350 - 900 MHz) | ||||||||||||||||||||
| 64 Bit | 64 Bit support | ||||||||||||||||||||
| Architecture | x86 | ||||||||||||||||||||
| Starting Price | $225 U.S. | ||||||||||||||||||||
| Announcement Date | 09/01/2015 | ||||||||||||||||||||
| Product Link (external) | ark.intel.com | ||||||||||||||||||||
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