Review Lenovo IdeaPad S300 Subnotebook
Intel Core i3-2365M | AMD Radeon HD 7450M | 13.30" | 1.6 kg
The Intel Core i3-2365M is a power efficient ULV (Ultra Low Voltage) processor for thin and light laptops. The base frequency of 1.4 GHz is relatively low and the CPU does not support Turbo Boost for automatic overclocking. Due to HyperThreading, the i3-2365M is able to handle 4 threads in parallel. Compared to similar clocked Celeron and Pentium models, the i3 features the faster HD 3000 graphics card and offers more enabled features (like Quick Sync). However, compared to the expensive i7 CPUs, the i3 lacks VT-d, Trusted Execution and VPro support. The difference to the similar Core i3-2367M is just the Small Business Advantage (SBA) support (needed for the Ultrabook logo).
Sandy Bridge is the evolutionary successor of the Arrandale architecture. The most notable improvements is the improved Turbo 2.0 (not used for the processing cores in the i3-2365M) and the integration of the graphics card into the 32nm CPU core.
The integrated Intel HD Graphics 3000 clocked at 350 or 1000 MHz (Turbo Boost). Due to the slower clock rate without the Turbo, compared to HD Graphics 3000 in 35W and 45W processors (usually clocked at 650 base speed in non LV processors), the performance should be noticeable lower.
The performance of the CPU should be a bit higher than a similar clocked Arrandale Core i3 ULV and therefore faster than the 1.33 GHz Core i3-380UM. The average performance of the CPU part should therefore be similar to the AMD A4-3300M. Detailed benchmarks can also be found on the CPU page of the Core i3-2367M.
The TDP of 17W (includes the integrated GPU and memory controller) allows the use of the 2365M CPU in small subnotebooks.
Codename | Sandy Bridge | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Intel Core i3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Core i3 Sandy Bridge
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Clock Rate | 1400 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Level 1 Cache | 128 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Level 2 Cache | 512 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Level 3 Cache | 3 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Number of Cores / Threads | 2 / 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Power Consumption (TDP = Thermal Design Power) | 17 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Transistor Count | 624 Million | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturing Technology | 32 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Die Size | 149 mm2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Max. Temperature | 100 °C | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Socket | FCBGA1023 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | HD Graphics 3000 (350-1000MHz), DDR3-1066/1333 Memory Controller (max 8GB), HyperThreading, AVX, Quick Sync, Virtualization | ||||||||||||||||||||||||||||||||||||||||||||||||||||
GPU | Intel HD Graphics 3000 (350 - 1000 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
64 Bit | 64 Bit support | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Announcement Date | 06/27/2011 |
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