Review Toshiba Satellite Pro C870 Notebook
Intel Core i3-2350M | Intel HD Graphics 3000 | 17.30" | 2.7 kg
The Intel Core i3-2350M is a dual core processor for laptops. It is based on the Sandy Bridge architecture and offers Hyper-threading to handle 4 threads at once (for a better usage of the pipeline). Compared to the faster Core i5, the i3 does not offer the Turbo Boost technique for the CPU part and is therefore clocked at 2.3 GHz (max). Compared to the Core i3-2310M, the 2330M offers 200 MHz more core clock rate.
Sandy Bridge is the evolutionary successor of the Arrandale architecture. The most noteable improvements are the new 256 Bit AVX instructions, the improved Turbo Boost 2.0 (not enabled for the processor part of the 2350M) and the integration of the graphics card into the 32nm CPU core.
Der i3-2350M offers an integrated graphics card (Intel HD Graphics 3000) which is clearly faster then the older Intel HD Graphics in the Arrandale CPUs. As the new GPU is included in the CPU, it is also manufactured in 32nm and shares the fast level 3 cache with the CPU cores (using a new ring bus). In the 2350M it is clocked from 650-1150MHz (with Turbo Boost). The faster Sandy Bridge CPUs are clocked up to 1300 MHz (like the i5-2520M).
Furthermore, an improved dual-channel DDR3 memory controller is included on the CPU die that is used by the CPU and GPU part. It supports up to 16GB DDR3-1333.
Due to the improved architecture, the average performance of the Core i3-2350M is higher than a similar clocked Arrandale Core i3 without Turbo Boost. In synthetic benchmarks, the performance is about on par with the faster clocked Core i3-390M (2.5 GHz) and therefore adequate for most applications.
The 35W TDP rating includes the integrated GPU and memory controller.
Codename | Sandy Bridge | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Intel Core i3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Core i3 Sandy Bridge
| |||||||||||||||||||||||||||||||||||||||||||||||||||||
Clock Rate | 2300 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Level 1 Cache | 128 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Level 2 Cache | 512 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Level 3 Cache | 3 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Number of Cores / Threads | 2 / 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Power Consumption (TDP = Thermal Design Power) | 35 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Transistor Count | 624 Million | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturing Technology | 32 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Die Size | 149 mm2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Max. Temperature | 85 (PGA), 100 (BGA) °C | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Socket | rPGA988B, BGA1023 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | HD Graphics 3000, DDR3-1066/1333 Memory Controller (max 8GB), HyperThreading, AVX, Quick Sync, Virtualization | ||||||||||||||||||||||||||||||||||||||||||||||||||||
GPU | Intel HD Graphics 3000 (650 - 1150 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
64 Bit | 64 Bit support | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Starting Price | $225 U.S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Announcement Date | 05/15/2011 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Product Link (external) | ark.intel.com |
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