AMD Ryzen AI 5 435

The AMD Ryzen AI 5 435 (or AMD Ryzen AI 5 H 435) is a powerful mobile processor from the Gorgon Point family that was announced at CES in early 2026. The APU features 6 CPU cores (2x Zen 5 with up to 4.5 GHz and 4x Zen 5c with less cache and a maximum of 3.4 GHz) and an 8-MB L3 cache. The SoC is similar to the older but higher-clocked AMD Ryzen AI 5 340.

Architecture and features

The Gorgon / Krackan Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores located in separate clusters, the latter being a slightly slower, smaller and more energy efficient version of the former. One of the differences between Zen 5 and Zen 5c is the size of the cache; the Zen 5 cores have larger caches available.

The mobile Zen 5 implementation is reportedly (ChipsAndCheese) closer to desktop Zen 4 than desktop Zen 5 due to different cache sizes, large differences in AVX-512 throughput, and other factors.

Elsewhere, the Ryzen AI 5 chip supports DDR5-5600 and LPDDR5x-8000 RAM, giving system designers a choice between lower latency and higher throughput. The chip is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for throughput of 1.9 GB/s per lane. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.

As usual with laptop CPUs, the Ryzen 5 AI chip cannot be replaced by the user as it is soldered-in.

CPU performance

Given the specs, the Ryzen 5 435 should be slightly slower than the old AMD Ryzen AI 5 340 which offers a similar core count but higher clock speeds.

GPU performance

The Radeon 840M is a downscaled Radeon 890M that offers only 4 cores (4 CUs = 256 shaders), a quarter of what the 890M has, and runs at up to 2.8 GHz. Up to 4 monitors can be driven by this iGPU, with SUHD 4320p support present, too. AVC, HEVC and AV1 hardware encoding and decoding is possible. VP9 can be decoded but not encoded.

Power consumption

The AI 435 is said to have a base TDP of 28 W, although laptop manufacturers are free to set the TDP to anything between 15 and 54 W.

The 4 nm TSMC process which these CPUs are manufactured on ensures solid energy efficiency, as of early 2026.

Codename	Gorgon Point
Series	AMD Strix / Gorgon Point
Series: Strix / Gorgon Point Gorgon Point AMD Ryzen AI 9 HX 475 2 - 5.2 GHz 12 / 24  24 MB L3 AMD Ryzen AI 9 HX PRO 475 2 - 5.2 GHz 12 / 24  24 MB L3 AMD Ryzen AI 9 HX 470 2 - 5.2 GHz 12 / 24  24 MB L3 AMD Ryzen AI 9 HX PRO 470 2 - 5.2 GHz 12 / 24  24 MB L3 AMD Ryzen AI 9 465 2 - 5 GHz 10 / 20  24 MB L3 AMD Ryzen AI 9 PRO 465 2 - 5 GHz 10 / 20  24 MB L3 AMD Ryzen AI 7 450 2 - 5.1 GHz 8 / 16  16 MB L3 AMD Ryzen AI 7 PRO 450 2 - 5.1 GHz 8 / 16  16 MB L3 AMD Ryzen AI 7 445 2 - 4.6 GHz 6 / 12  8 MB L3 AMD Ryzen AI 5 PRO 440 2 - 4.8 GHz 6 / 12  16 MB L3 AMD Ryzen AI 5 435 « 2 - 4.5 GHz 6 / 12  8 MB L3 AMD Ryzen AI 5 PRO 435 2 - 4.5 GHz 6 / 12  8 MB L3 AMD Ryzen AI 5 430 2 - 4.5 GHz 4 / 8  8 MB L3
Clock Rate	2000 - 4500 MHz
Level 1 Cache	480 KB
Level 2 Cache	6 MB
Level 3 Cache	8 MB
Number of Cores / Threads	6 / 12 2 x 4.5 GHz AMD Zen 5 4 x 3.4 GHz AMD Zen 5c
Power Consumption (TDP = Thermal Design Power)	28 Watt
TDP Turbo PL2	54 Watt
Manufacturing Technology	4 nm
Max. Temperature	100 °C
Socket	FP8
Features	DDR5-5600/LPDDR5x-8000 RAM, PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), SMT, MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, AVX512, BMI2, ABM, FMA, ADX, SMEP, SMAP, CPB, AES-NI, RDRAND, RDSEED, SHA, SME
GPU	AMD Radeon 840M ( - 2800 MHz)
NPU / AI	50 TOPS INT8
Chip AI	59 TOPS INT8
64 Bit	64 Bit support
Architecture	x86
Announcement Date	01/05/2026
Product Link (external)	www.amd.com

Benchmarks