The AMD Ryzen AI 7 450 or AMD Ryzen AI 7 H 450 is a powerful mobile processor from the Gorgon Point family and was announced early 2026. The APU integrates 8 CPU cores (4x Zen 5 with up to 5.1 GHz and 4x Zen 5c with less cache and probably a maximum of 3.6 GHz). The CPU is identical to the older Ryzen AI 7 350 except for the 100 MHz higher CPU clock rate and support for LPDR5-8533.
Architecture and features
The Gorgon and Krackan Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores located in separate clusters, the latter being a slightly slower, smaller and more energy-efficient version of the former. One of the differences between Zen 5 and Zen 5c is the size of the cache; the Zen 5 cores have larger caches available.
However, the mobile Zen 5 implementation is reportedly (ChipsAndCheese) is closer to desktop Zen 4 than desktop Zen 5 due to the different cache sizes, large differences in AVX-512 throughput, and other factors.
Elsewhere, the Ryzen AI 7 chip supports LPDDR5x-8533 RAM. The chip is natively compatible with USB 4 (and thus Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors. The integrated XDNA 2 NPU, which is much more complex than the first generation XDNA, delivers up to 50 INT8 TOPS for accelerating various AI workloads.
As usual with laptop CPUs, the Ryzen 7 AI chip cannot be replaced by the user as it is soldered.
Performance
Due to the only slightly higher clock rate, the performance should only be slightly above the old Ryzen AI 7 350 chip. Compared to Intel, the performance should be comparable to an Intel Core i7-13900H should be comparable.
Graphics
The Radeon 860M is the direct successor to the Radeon 760M and offers 8 cores (CUs = 512 shaders) and clocks at up to 3.1 GHz. It uses the new RDNA 3.5 architecture.
Power consumption
The AI 450 is said to have a base TDP of 28 W, although laptop manufacturers are free to set the TDP between 15 and 54 W.
The 4 nm TSMC process with which these CPUs are manufactured ensures above-average energy efficiency.
| Codename | Gorgon Point | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Series | AMD Strix / Gorgon Point | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Strix / Gorgon Point Gorgon Point
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| Clock Rate | 2000 - 5100 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Level 1 Cache | 640 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Level 2 Cache | 8 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Level 3 Cache | 16 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Number of Cores / Threads | 8 / 16 4 x 5.1 GHz AMD Zen 5 4 x 3.6 GHz AMD Zen 5c | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Power Consumption (TDP = Thermal Design Power) | 28 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| TDP Turbo PL2 | 54 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Manufacturing Technology | 4 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Socket | FP8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Features | DDR5-5600/LPDDR5x-8000 RAM, PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), Secure Processor, SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| GPU | AMD Radeon 860M ( - 3100 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NPU / AI | 50 TOPS INT8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Chip AI | 66 TOPS INT8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| 64 Bit | 64 Bit support | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Architecture | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Announcement Date | 01/05/2026 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Product Link (external) | www.amd.com | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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