AMD Ryzen AI Max+ 392
The AMD Ryzen AI Max+ 392 is a powerful Strix Halo family processor that debuted in January 2026. The APU comes equipped with 12 Zen 5 CPU cores running at up to 5.0 GHz, the 40 CU RDNA 3+ Radeon 8060S graphics adapter and the 50 TOPS XDNA 2 neural engine. Other noteworthy features include PCIe 4, USB 4 and LPDDR5x-8000 RAM support and a whole lot of L3 cache. The SoC is similar to the AI Max 390, but offers a faster iGPU.
Architecture and Features
Unlike it is with Strix Point, Strix Halo parts are powered by Zen 5 cores - no Zen 5c here. It's not clear if this is the desktop Zen 5 implementation with full AVX512 throughput or the mobile one. According to AMD, Zen 5 delivers a 16% IPC improvement over Zen 4 thanks to branch prediction improvements and other refinements.
Elsewhere, the AI Max chip supports RAM as fast as LPDDR5x-8000, and is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors had. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.
Performance
Its CPU performance should be about 10% higher than that of the Ryzen AI 9 HX 370 and HX 375 due to the AI Max chip's higher TDP power target and lack of cut-down Zen 5c cores.
Graphics
The Radeon 8060S is the most powerful iGPU that AMD has on offer, as of Jan 2025. It features 40 RDNA 3+ architecture CUs (2560 unified shaders) that could see it outcompeting lower mid-range desktop graphics cards like the GeForce RTX 4050. This GPU will undoubtedly run any game at 1080p on Ultra, however, the ultimate question is whether or not the cooling solution of the laptop will be powerful enough to let the iGPU shine.
Naturally, the Radeon is capable of driving four SUHD 4320p60 monitors. It can also efficiently encode and decode the most popular video codecs including AVC, HEVC, VP9 and AV1. The latest addition to that list, the VVC codec, is not supported unlike it is with Intel Lunar Lake chips.
Power consumption
The AI Max+ 392 can eat up to 120 W depending on the system and its TDP power targets, with 45 W named as the minimum TDP.
The 4 nm TSMC process that the CPU cores are built with make for decent, as of Jan 2025, energy efficiency.
| Codename | Strix Halo | ||||||||||||||||||||
| Series | AMD Strix / Gorgon Halo | ||||||||||||||||||||
Series: Strix / Gorgon Halo Strix Halo
| |||||||||||||||||||||
| Clock Rate | 3200 - 5000 MHz | ||||||||||||||||||||
| Level 2 Cache | 12 MB | ||||||||||||||||||||
| Level 3 Cache | 64 MB | ||||||||||||||||||||
| Number of Cores / Threads | 12 / 24 12 x 5.0 GHz AMD Zen 5 | ||||||||||||||||||||
| Power Consumption (TDP = Thermal Design Power) | 55 Watt | ||||||||||||||||||||
| Manufacturing Technology | 4 nm | ||||||||||||||||||||
| Max. Temperature | 100 °C | ||||||||||||||||||||
| Socket | FP11 | ||||||||||||||||||||
| Features | LPDDR5x-8000 RAM, PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | ||||||||||||||||||||
| GPU | AMD Radeon 8060S ( - 2900 MHz) | ||||||||||||||||||||
| NPU / AI | 50 TOPS INT8 | ||||||||||||||||||||
| Chip AI | 122 TOPS INT8 | ||||||||||||||||||||
| 64 Bit | 64 Bit support | ||||||||||||||||||||
| Architecture | x86 | ||||||||||||||||||||
| Announcement Date | 01/06/2026 | ||||||||||||||||||||
| Product Link (external) | www.amd.com | ||||||||||||||||||||
Benchmarks
- Average benchmark values* Smaller numbers mean a higher performance
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Reviews for the AMD Ryzen AI Max+ 392 processor
Asus TUF Gaming A14 FA401EA : AMD Radeon 8060S, 14.00", 1.5 kg
External Review » Asus TUF Gaming A14 FA401EA
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