AMD Ryzen AI Max+ PRO 495

The AMD Ryzen AI Max+ PRO 495 is a powerful processor from the Gorgon Halo family, which was introduced in May 2026. The APU has 16 Zen 5 CPU cores clocked at up to 5.2 GHz, a 40 CU RDNA 3+ Radeon 8065S graphics card and a 55 TOPS XDNA 2 Neural Engine. Other features include PCIe 4, USB 4 and LPDDR5x-8000 RAM support as well as 64 MB L3 cache. Compared to the similar Ryzen AI Max+ PRO 395, the 495 offers slightly higher clocked CPU, GPU and NPU cores. As a "PRO CPU", the 495 offers support for management and additional security features.
Architecture and functions
In contrast to the Gorgon Point, the Gorgon Halo chips are only powered by Zen 5 cores - and no Zen 5c. It is not clear whether this is the desktop Zen 5 implementation with full AVX512 throughput or the mobile implementation. According to AMD, Zen 5 offers a 16% IPC improvement over Zen 4 thanks to improved branch prediction and other refinements.
The AI Max+ chip supports RAM with a speed of LPDDR5x-8000 and is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors. The integrated XDNA 2 NPU delivers up to 55 INT8 TOPS for accelerating various AI workloads.
Performance
The CPU performance should be very similar to the Ryzen AI Max+ 395, as the CPU cores are only clocked 100 MHz higher (+2%). The performance should therefore be comparable to the Core i9-14900HX should be comparable.
Graphics
The Radeon 8065S is the most powerful iGPU AMD has to offer (as of May 2026). It has 40 CUs of the RDNA 3+ architecture (2560 unified shaders) and could therefore outperform lower mid-range desktop graphics cards such as the GeForce RTX 4050.
Of course, the Radeon is capable of driving four SUHD 4320p60 monitors. It can also efficiently encode and decode the most common video codecs such as AVC, HEVC, VP9 and AV1. The latest addition to this list, the VVC codec, is not supported, unlike the Intel Lunar Lake chips.
Power consumption
The AI Max+ PRO 495 can consume up to 120 W depending on the system and its TDP performance targets, with 45 W specified as the minimum TDP.
The 4 nm TSMC process used to manufacture the CPU cores ensures good energy efficiency.
| Codename | Strix Halo PRO | ||||||||||||||||||||
| Series | AMD Strix Halo | ||||||||||||||||||||
Series: Strix Halo Strix Halo PRO
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| Clock Rate | 3100 - 5200 MHz | ||||||||||||||||||||
| Level 2 Cache | 16 MB | ||||||||||||||||||||
| Level 3 Cache | 64 MB | ||||||||||||||||||||
| Number of Cores / Threads | 16 / 32 16 x 5.2 GHz AMD Zen 5 | ||||||||||||||||||||
| Power Consumption (TDP = Thermal Design Power) | 55 Watt | ||||||||||||||||||||
| Manufacturing Technology | 4 nm | ||||||||||||||||||||
| Socket | FP11 | ||||||||||||||||||||
| Features | LPDDR5x-8000 RAM, PCIe 4, USB 4, XDNA 2 NPU (50 TOPS), SMT, AES, AVX, AVX2, AVX512, FMA3, MMX (+), SHA, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4A | ||||||||||||||||||||
| GPU | AMD Radeon 8065S | ||||||||||||||||||||
| NPU / AI | 55 TOPS INT8 | ||||||||||||||||||||
| Chip AI | 131 TOPS INT8 | ||||||||||||||||||||
| 64 Bit | 64 Bit support | ||||||||||||||||||||
| Architecture | x86 | ||||||||||||||||||||
| Announcement Date | 05/21/2026 | ||||||||||||||||||||
| Product Link (external) | www.amd.com | ||||||||||||||||||||
Benchmarks
* Smaller numbers mean a higher performance
No reviews found for this CPU (yet).