Intel Core i3-1115G4 vs MediaTek Dimensity 800 vs Intel Core i5-1135G7

Intel Core i3-1115G4

The Intel Core i3-1115G4 is a dual-core SoC for laptops and Ultrabooks based on the Tiger Lake-U generation (UP3) that was launched in September 2020. It integrates two Willow Cove processor cores (4 threads thanks to HyperThreading). Each core can clock from 3 GHz (base speed) to 4.1 GHz (single- and dual-core boost). The faster Core i5 and i7 models offer more cores and are therefore significantly faster.

Another novelty is the integrated Xe graphics card based on the completely new Gen 12 architecture. In the i3-1115G4 Intel is naming the GPU UHD Graphics and offers only 48 of the 96 EUs clocked at 400 - 1250 MHz. GPU and CPU can together use the 6 MB of L3 cache.

Furthermore, Tiger Lake SoCs add PCIe 4 support (four lanes), AI hardware acceleration, and the partial integration of Thunderbolt 4 / USB 4 and WiFi 6 in the chip.

The chip is produced on the second-gen 10 nm Intel SuperFin process that should be comparable to the 7 nm TSMC process (e.g. Ryzen 4000 series).

Performance

Multi-thread peformance is most comparable to what the Intel Core i5-8250U and the AMD Ryzen 5 3450U deliver. This makes the i3 a more than decent option for day-to-day tasks; that said, any workload of the more taxing kind (such as exporting a high-bitrate, hour long UHD video) will be enough to bring the i3 to its knees.

Thanks to its decent cooling solution and a long-term CPU power limit of 25 W, the ThinkPad L15 G2-20X4S0KU00 is one of the fastest laptops powered by the 1115G4 we know of. It can be more than 20% faster in CPU-bound workloads than the slowest system featuring the same chip in our database, as of August 2023.

Power consumption

This Core i3 series chip has a default TDP of 12 W to 28 W, the expectation being that laptop makers will go for a higher value in exchange for higher performance. Either way, that's a tad too high to allow for passively cooled laptops, tablets, mini-PCs.

The Core i3-1115G4 is built with Intel's third-gen 10 nm process marketed as SuperFin for decent, as of mid 2022, energy efficiency.

MediaTek Dimensity 800

The Mediatek Dimensity 800 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G57 MC4 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.

Compared to the similar named Dimensity 800U, the 800 offers two more big A76 cores but clocked 400 MHz lower. This means the single core performance is lower, but the multi-core performance can be better.

The Dimensity 800 is manufactured in the modern 7nm process and should be very power efficient.

Intel Core i5-1135G7

The Intel Core i5-1135G7 is a quad-core, mid-range SoC designed to be used in ultra-light laptops. The Tiger Lake-UP3 processor was introduced in September 2020. It features four Willow Cove CPU cores running at 2.4 GHz (base clock speed @ 28 W TDP) Boosting up to 4.2 GHz (1-core Boost). The all-core Boost clock speed sits at 3.8 GHz. This is a Hyper-Threading-enabled CPU, allowing for up to 8 concurrent processing threads.

Architecture

A sizeable performance-per-MHz boost is one of the multiple strengths of Tiger Lake compared to the older Ice Lake and Comet Lake product families. Core i5-1135G7 is compatible with dual-channel DDR4-3200 or quad-channel LPDDR4x-4267 RAM, supports PCI-Express 4.0 (4 lanes) and is capable of HW-accelerating AI workloads. Thunderbolt 4, USB 4 and Wi-Fi 6 support is partially baked into the chip. Four PCI-Express 4.0 lanes allow for read/write rates of up to 7.9 GB/s, provided a suitably fast NVMe SSD is used.

The i5 is manufactured on Intel's third-gen 10 nm process marketed as SuperFin that is supposedly comparable to TSMC's 7 nm process that Ryzen 4000 series laptop-grade processors are manufactured on. Both the CPU cores and the iGPU enjoy access to 8 MB of L3 cache. Higher-end Core i7-11x5 processors are notable for their larger Level 3 cache (12 MB versus 8 MB), faster iGPUs and higher clock speeds. Core i5-1135G7 is supposed to be permanently soldered to the motherboard (BGA1449 socket interface) and is thus not user-replaceable.

Performance

The average i5-1135G7 in our database delivers multi-thread benchmark scores close to those of the Core i7-10810U, Core i5-1145G7, Core i5-1230U and also the Ryzen 7 3780U. The performance may not be ground-breaking, but it’s still on the sunnier side. This Core i5 will have no difficulty coping with some light gaming and video editing on the go, and the usual web browsing and spreadsheet editing will pose no problem to it, either.

Thanks to its decent cooling solution and a long-term CPU power limit of 25 W, the Lenovo Yoga Slim 7 14ITL05 is among the fastest laptops built around the 1135G7 that we know of. It can be about 60% faster in CPU-bound workloads than the slowest system featuring the same chip in our database, as of August 2023.

Graphics

The 80 EU Iris Xe Graphics G7 is based on Intel's Gen 12 architecture. The iGPU is somewhat faster than the older Iris Plus G7 (Ice Lake) and much faster than the UHD 620 (Comet Lake). The 80 EUs are clocked at 400 MHz to 1,300 MHz. This graphics adapter can drive up to 4 monitors in resolutions up to SUHD 4320p@60 and hardware decode the AVC, HEVC, VP9 and last but not the least AV1 video streams. The iGPU's gaming performance is close to what a typical GeForce MX250 has in store; casual gamers will be happy with the Xe as it will easily handle most titles at 720p on low or medium quality settings. An important thing to keep in mind is that the iGPU has no video memory of its own, making fast RAM a necessity.

Power consumption

Just like all other Tiger Lake-UP3 chips, the i5-1135G7 has a default TDP of 12 W to 28 W, the expectation being that laptop makers will go for a higher value to get higher clock speeds and thus better performance. Either way, these values are a tad too high to allow for passively cooled designs.

The CPU is built with Intel's 3rd generation 10 nm process marketed as SuperFin for decent, as of mid 2022, energy efficiency.