The MediaTek Dimensity 8300-Ultra presented in Q4 2023 is an ARM-based SoC (system-on-a-chip) that is manufactured using the 4 nm process. It was specially designed for use in Android smartphones and is in the lower upper class in terms of performance. It supports all current mobile communication standards, including 5G SA.
The CPU works with a total of eight cores, which are divided into two clusters. The first cluster contains one ARM Cortex-A715 power core, which operates at up to 3.35 GHz. In addition, there are 3 further ARM Cortex-A715 cores with 3.2 GHz. The second cluster contains four ARM Cortex-A510 energy-saving cores with 2.2 GHz. LPDDR5 RAM can be used as RAM and UFS 4.0 is supported as internal memory.
Compared to the predecessor MediaTek Dimensity 8200-Ultra the MediaTek Dimensity 8300-Ultra is said to offer up to 20 percent higher CPU performance and up to 60 percent higher GPU performance. According to the manufacturer, the energy efficiency for CPU and GPU has also improved (+30%/+55%).
In terms of connectivity, dual 5G with a theoretical peak download speed of up to 5.17 GBit/s is available, as well as WiFi 6E and Bluetooth 5.4.
The Mediatek Dimensity 8300-Ultra is a variant of the otherwise identical Mediatek Dimensity 8300 that has been specially adapted for Xiaomi and features improvements to the camera ISP. An Imagiq 980 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps.
The integrated ARM Mali-G615 MC6 graphics unit can control displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.
Series
Mediatek
Codename
Cortex-A15 / A510
Clock Rate
2200 - 3350 MHz
Level 3 Cache
4 MB
Number of Cores / Threads
8 / 8 3.4 GHz 4 x 3.2 GHz ARM Cortex-A715 4 x 2.2 GHz ARM Cortex-A510
Manufacturing Technology
4 nm
Features
ARM Mali-G610 MC6 GPU, Dual 5G modem, WiFi 6E, Bluetooth 5.3, H.264/HEVC video decoding