AMD Ryzen AI 9 HX 370 vs Intel Core Ultra 7 258V

AMD Ryzen AI 9 HX 370

The AMD Ryzen AI 9 HX 370 is a powerful Strix Point family processor that debuted in June 2024. The APU comes with 12 CPU cores running at 2.0 GHz to 5.1 GHz, the 16 CU RDNA 3+ Radeon 890M graphics adapter and the 50 TOPS XDNA 2 neural engine. Other noteworthy features include PCIe 4, USB 4 and LPDDR5x-8000 RAM support.

Of the 12 CPU cores, 4 are full Zen 5 cores and 8 are smaller Zen 5c cores. The latter run at significantly lower clock speeds than the former.

Architecture and Features

Strix Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores, the latter being a slightly slower, smaller and more energy-efficient version of the former. One of the differences between Zen 5 and Zen 5c is cache size; Zen 5 cores have larger caches to work with. According to AMD, Zen 5 delivers a 16% IPC improvement over Zen 4 thanks to branch prediction improvements and other refinements.

Elsewhere, the HX 370 supports LPDDR5x-8000 and DDR5-5600 RAM, and is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors did. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.

Performance

Given the IPC improvement, we expect 4 Zen 5 cores combined with 8 Zen 5c cores to perform about as well as 16 Zen 4 cores meaning there is a real chance of the HX 370 dethroning the Ryzen 9 7945HX3D. We'll make sure to update this section once we get our hands on a laptop powered by the HX 370.

Graphics

The Radeon 890M is the most powerful iGPU that AMD has on offer right now. It features 16 RDNA 3+ architecture CUs (1024 unified shaders) running at up to 2,900 MHz. We expect the graphics adapter to deliver gaming performance good enough for playing 2023 and 2024 games in 1080p (Low detail settings).

Naturally, the 890M is capable of driving four SUHD 4320p60 monitors. It can also efficiently encode and decode the most popular video codecs including AVC, HEVC, VP9 and AV1. The latest addition to that list, the VVC codec, is not supported unlike it is with Intel Lunar Lake chips.

Power consumption

The HX 370 is supposed to have a base TDP of 28 W, with laptop makers free to crank it up to up to 54 W. Which they will most likely do to maximize performance.

The 4 nm TSMC process that the CPU cores are built with make for decent, as of mid 2024, energy efficiency.

Intel Core Ultra 7 258V

The Intel Core Ultra 5 258V is an upper mid-range Lunar Lake family processor. This is an SoC for use in tablets and laptops of the slimmer kind that was unveiled in Autumn 2024. It sports 4 new Skymont E-cores and 4 new Lion Cove P-cores running at up to 3.7 GHz and 4.8 GHz respectively, along with the new Arc 140V iGPU and 32 GB of on-package LPDDR5x-8533 RAM. A new 47 TOPS neural engine, Thunderbolt 4 and PCIe 5 SSD support are included as well.

The only difference between this chip and the Ultra 7 256V is the amount of on-package, non-replaceable RAM: 32 GB vs 16 GB respectively.

Architecture and Features

Lunar Lake is built using the Foveros technology (stacking several dies on top of each other and next to each other), just like Meteor Lake was. The new chips make use of the enormous BGA2833 socket interface. Of the 8 cores, not a single one is Hyper-Threading-enabled which is the opposite of what AMD currently does with its Zen 5/5c chips.

Intel claims Lion Cove cores bring a 14% IPC improvement over Redwood Cove. For Skymont and Crestmont, the difference is much higher at 68%. Several tweaks and improvements are present here, such as the Low Latency Fabric that is supposed to make small data transfers between cores/caches a lot faster. The 258V has a very healthy 12 MB of level 3 cache; elsewhere, it has 4 PCIe 5 and 4 PCIe 4 lanes for connecting various kinds of devices, including NVMe SSDs at up to 15.75 GB/s. Thunderbolt 4 support is onboard by default, as is support for CNVi WiFi 7 + BT 5.4 cards from Intel. The 47 TOPS "AI Boost" neural engine is present along with technologies such as Threat Detection to make AI-enabled applications such as the Windows Defender more powerful.

Intel is predicted to get short of on-package RAM in subsequent CPU generations.

Performance

Based on the time we've had with 2 systems powered by the 258V, the chip's multi-thread performance is as good as that of the Core Ultra 7 165U and the Core i7-1360P. Please note that one of the two systems had a higher long-term TDP power target than the Intel-recommended value: 32 W vs 17 W.

Generally speaking, the 288V, 268V, 266V, 258V, 256V are faster than the 238V, 236V, 228V and 226V due to the difference in their last-level cache size (8 MB vs 12 MB) as well as clock speeds. However, the difference in performance between the slowest Lunar Lake chip, the 226V, and the fastest chip, the 288V is fairly small at around 10% to 15%. It depends on the TDP figures of the laptops being pitted against each other more than on anything else.

Graphics

The Arc Graphics 140V is here to replace the Arc 8 iGPU. Its 8 Xe² architecture "cores" run at up to 1,950 MHz and it also has 8 ray tracing units at its disposal. The adapter is DirectX 12 Ultimate-enabled and able to HW-decode a long list of popular video codecs such as h.266 VVC, h.265 HEVC, h.264 AVC, AV1 and VP9. Three SUHD 4320p monitors can be used simultaneously with this iGPU.

All 2023 and 2024 games are playable at 1080p on low graphics settings or higher with this iGPU. We got well over 30 fps in Ghost of Tsushima and almost 40 fps in Baldur's Gate 3. This means the Radeon 780M gets left behind while the Radeon 890M reigns supreme.

Power consumption

This 2nd generation Core Ultra processor is supposed to consume 17 W when under long-term workloads. The Intel-recommended short-term power limit for the chip sits at 37 W.