AMD Ryzen AI 9 HX 370 vs Intel Core Ultra 9 285H vs AMD Ryzen AI Max+ 395

AMD Ryzen AI 9 HX 370

The AMD Ryzen AI 9 HX 370 is a powerful Strix Point family processor that debuted in June 2024. The APU comes with 12 CPU cores running at 2.0 GHz to 5.1 GHz, the 16 CU RDNA 3+ Radeon 890M graphics adapter and the 50 TOPS XDNA 2 neural engine. Other noteworthy features include PCIe 4, USB 4 and LPDDR5x-8000 RAM support.

Of the 12 CPU cores, 4 are full Zen 5 cores and 8 are smaller Zen 5c cores. The latter run at significantly lower clock speeds than the former.

Architecture and Features

Strix Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores, the latter being a slightly slower, smaller and more energy-efficient version of the former. One of the differences between Zen 5 and Zen 5c is cache size; Zen 5 cores have larger caches to work with. According to AMD, Zen 5 delivers a 16% IPC improvement over Zen 4 thanks to branch prediction improvements and other refinements.

Elsewhere, the HX 370 supports LPDDR5x-8000 and DDR5-5600 RAM, and is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors did. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.

Performance

Given the IPC improvement, we expect 4 Zen 5 cores combined with 8 Zen 5c cores to perform about as well as 16 Zen 4 cores meaning there is a real chance of the HX 370 dethroning the Ryzen 9 7945HX3D. We'll make sure to update this section once we get our hands on a laptop powered by the HX 370.

Graphics

The Radeon 890M is the most powerful iGPU that AMD has on offer right now. It features 16 RDNA 3+ architecture CUs (1024 unified shaders) running at up to 2,900 MHz. We expect the graphics adapter to deliver gaming performance good enough for playing 2023 and 2024 games in 1080p (Low detail settings).

Naturally, the 890M is capable of driving four SUHD 4320p60 monitors. It can also efficiently encode and decode the most popular video codecs including AVC, HEVC, VP9 and AV1. The latest addition to that list, the VVC codec, is not supported unlike it is with Intel Lunar Lake chips.

Power consumption

The HX 370 is supposed to have a base TDP of 28 W, with laptop makers free to crank it up to up to 54 W. Which they will most likely do to maximize performance.

The 4 nm TSMC process that the CPU cores are built with make for decent, as of mid 2024, energy efficiency.

Intel Core Ultra 9 285H

The Intel Core Ultra 9 285H is a mobile high-end CPU for larger notebooks based on the Arrow Lake architecture. It offers 16 cores consisting of 6 fast performance cores (Lion Cove) with up to 5.4 GHz and 8 smaller efficiency cores (Skymont) with up to 4.5 GHz clock speed and two additional low power cores with up to 2.5 GHz (Skymont). The CPU has access to 24 MB of cache and is specified with a TDP of 45 watts.

The SoC integrates a small dedicated NPU called AI Boost with 13 TOPS (Int8) and optionally supports vPro Enterprise. The integrated memory controller supports up to 192 GB LPDDR5/x-8400 or DDR5-6400 (dual channel). The integrated GPU (iGPU) is an Intel Arc 140T graphics card that offers eight Xe cores with up to 2.35 GHz.

Performance - High End

The top model offers all the cores that are built into the chip and clocks relatively high at up to 5.4 GHz. Thanks to the improved IPC of the cores (especially the efficiency cores), the CPU should reach the level of the old Raptor Lake Core Core 9 270H (6 + 8 cores, max 5.8 / 4.1 GHz). This makes the CPU ideal for very demanding tasks such as high-end gaming and content creation.

Chiplet Design

Like the desktop and HX chips, the Arrow Lake-H chips are based on individual chiplets that are placed on a 22nm base tile from Intel using Foveros 3D packaging. The CPU part comes from TSMC using the modern N3B (3nm) process. As with HX, the GPU also is produced at TSMC and is manufactured using the N5P process. SoC and I/O Tile are also from TSMC but in the older N6 process.

AMD Ryzen AI Max+ 395

The AMD Ryzen AI Max+ 395 is a powerful Strix Halo family processor that debuted in January 2025. The APU comes with 16 Zen 5 CPU cores running at up to 5.1 GHz, the 40 CU RDNA 3+ Radeon 8060S graphics adapter and the 50 TOPS XDNA 2 neural engine. Other noteworthy features include PCIe 4, USB 4 and LPDDR5x-8000 RAM support and a whole lot of L3 cache.

Architecture and Features

Unlike Strix Point, Strix Halo parts are powered by Zen 5 cores - no Zen 5c here. It's not clear if this is the desktop Zen 5 implementation with full AVX512 throughput or the mobile one. According to AMD, Zen 5 delivers a 16% IPC improvement over Zen 4 thanks to branch prediction improvements and other refinements.

Elsewhere, the AI Max+ chip supports RAM as fast as LPDDR5x-8000, and is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors had. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.

Performance

From leaks, we know that the Ryzen delivers around 20,700 Geekbench 6.3 Multi points, meaning it trades blow with very powerful desktop CPUs like the Ryzen 9 9900X.

Graphics

The Radeon 8060S is the most powerful iGPU that AMD has on offer, as of Jan 2025. It features 40 RDNA 3+ architecture CUs (2560 unified shaders) that could see it outcompeting lower mid-range desktop graphics cards like the GeForce RTX 4050. This GPU will undoubtedly run any game at 1080p on Ultra, however, the ultimate question is whether or not the cooling solution of the laptop will be powerful enough to let the iGPU shine.

Naturally, the Radeon is capable of driving four SUHD 4320p60 monitors. It can also efficiently encode and decode the most popular video codecs including AVC, HEVC, VP9 and AV1. The latest addition to that list, the VVC codec, is not supported unlike it is with Intel Lunar Lake chips.

Power consumption

The AI Max+ 395 can eat up to 120 W depending on the system and its TDP power targets, with 45 W named as the minimum TDP.

The 4 nm TSMC process that the CPU cores are built with make for decent, as of Jan 2025, energy efficiency.