The AMD Ryzen AI 9 HX 370 is a powerful Strix Point family processor that debuted in June 2024. The APU comes with 12 CPU cores running at 2.0 GHz to 5.1 GHz, the 16 CU RDNA 3+ Radeon 890M graphics adapter and the 50 TOPS XDNA 2 neural engine. Other noteworthy features include PCIe 4, USB 4 and LPDDR5x-8000 RAM support.
Of the 12 CPU cores, 4 are full Zen 5 cores and 8 are smaller Zen 5c cores. The latter run at significantly lower clock speeds than the former.
Architecture and Features
Strix Point family APUs are powered by Zen 5 and Zen 5c microarchitecture cores, the latter being a slightly slower, smaller and more energy-efficient version of the former. One of the differences between Zen 5 and Zen 5c is cache size; Zen 5 cores have larger caches to work with. According to AMD, Zen 5 delivers a 16% IPC improvement over Zen 4 thanks to branch prediction improvements and other refinements.
Elsewhere, the HX 370 supports LPDDR5x-8000 and DDR5-5600 RAM, and is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors did. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.
Performance
Given the IPC improvement, we expect 4 Zen 5 cores combined with 8 Zen 5c cores to perform about as well as 16 Zen 4 cores meaning there is a real chance of the HX 370 dethroning the Ryzen 9 7945HX3D. We'll make sure to update this section once we get our hands on a laptop powered by the HX 370.
Graphics
The Radeon 890M is the most powerful iGPU that AMD has on offer right now. It features 16 RDNA 3+ architecture CUs (1024 unified shaders) running at up to 2,900 MHz. We expect the graphics adapter to deliver gaming performance good enough for playing 2023 and 2024 games in 1080p (Low detail settings).
Naturally, the 890M is capable of driving four SUHD 4320p60 monitors. It can also efficiently encode and decode the most popular video codecs including AVC, HEVC, VP9 and AV1. The latest addition to that list, the VVC codec, is not supported unlike it is with Intel Lunar Lake chips.
Power consumption
The HX 370 is supposed to have a base TDP of 28 W, with laptop makers free to crank it up to up to 54 W. Which they will most likely do to maximize performance.
The 4 nm TSMC process that the CPU cores are built with make for decent, as of mid 2024, energy efficiency.
The AMD Ryzen AI Max+ 395 is a powerful Strix Halo family processor that debuted in January 2025. The APU comes with 16 Zen 5 CPU cores running at up to 5.1 GHz, the 40 CU RDNA 3+ Radeon 8060S graphics adapter and the 50 TOPS XDNA 2 neural engine. Other noteworthy features include PCIe 4, USB 4 and LPDDR5x-8000 RAM support and a whole lot of L3 cache.
Architecture and Features
Unlike Strix Point, Strix Halo parts are powered by Zen 5 cores - no Zen 5c here. It's not clear if this is the desktop Zen 5 implementation with full AVX512 throughput or the mobile one. According to AMD, Zen 5 delivers a 16% IPC improvement over Zen 4 thanks to branch prediction improvements and other refinements.
Elsewhere, the AI Max+ chip supports RAM as fast as LPDDR5x-8000, and is natively compatible with USB 4 (and therefore Thunderbolt). It has PCIe 4.0 support for a throughput of 1.9 GB/s per lane, just like its 8000 series predecessors had. The integrated XDNA 2 NPU delivers up to 50 INT8 TOPS for accelerating various AI workloads.
Performance
From leaks, we know that the Ryzen delivers around 20,700 Geekbench 6.3 Multi points, meaning it trades blow with very powerful desktop CPUs like the Ryzen 9 9900X.
Graphics
The Radeon 8060S is the most powerful iGPU that AMD has on offer, as of Jan 2025. It features 40 RDNA 3+ architecture CUs (2560 unified shaders) that could see it outcompeting lower mid-range desktop graphics cards like the GeForce RTX 4050. This GPU will undoubtedly run any game at 1080p on Ultra, however, the ultimate question is whether or not the cooling solution of the laptop will be powerful enough to let the iGPU shine.
Naturally, the Radeon is capable of driving four SUHD 4320p60 monitors. It can also efficiently encode and decode the most popular video codecs including AVC, HEVC, VP9 and AV1. The latest addition to that list, the VVC codec, is not supported unlike it is with Intel Lunar Lake chips.
Power consumption
The AI Max+ 395 can eat up to 120 W depending on the system and its TDP power targets, with 45 W named as the minimum TDP.
The 4 nm TSMC process that the CPU cores are built with make for decent, as of Jan 2025, energy efficiency.
Average Benchmarks AMD Ryzen AI 9 HX 370 → 100%n=40
Average Benchmarks AMD Ryzen AI Max+ 395 → 139%n=40
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
v1.33
log 15. 23:29:18
#0 ran 0s before starting gpusingle class +0s ... 0s
#1 checking url part for id 17543 +0s ... 0s
#2 checking url part for id 18628 +0s ... 0s
#3 redirected to Ajax server, took 1752614957s time from redirect:0 +0s ... 0s
#4 did not recreate cache, as it is less than 5 days old! Created at Sun, 13 Jul 2025 05:20:07 +0200 +0s ... 0s
#5 composed specs +0.004s ... 0.004s
#6 did output specs +0s ... 0.004s
#7 getting avg benchmarks for device 17543 +0.004s ... 0.008s
#8 got single benchmarks 17543 +0.026s ... 0.034s
#9 getting avg benchmarks for device 18628 +0.004s ... 0.038s
#10 got single benchmarks 18628 +0.005s ... 0.042s
#11 got avg benchmarks for devices +0s ... 0.042s
#12 min, max, avg, median took s +0.055s ... 0.097s
- Average benchmark values for this graphics card
