Intel Pentium Gold 4415U vs AMD Ryzen 9 6900HX vs Intel Core i3-7100H

Intel Pentium Gold 4415U

The Intel Pentium 4415U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.3 GHz (no Turbo Boost), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Compared to the more expensive Core i3-7100U, the 4415U offers a similar CPU performance (2.3 versus 2.4 GHz) and less level 3 cache but a slower integrated graphics card. Still, the CPU has sufficient power for office and multimedia purposes as well as somewhat more demanding applications.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 950 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.

AMD Ryzen 9 6900HX

The AMD Ryzen 9 6900HX is a processor for big (gaming) laptops based on the Rembrandt generation. The R9 6900HX integrates all eight cores based on the Zen 3+ microarchitecture. They are clocked at 3.3 (guaranteed base clock) to 4.9 GHz (Turbo) and support SMT / Hyperthreading (16 threads). The chip is manufactured on the modern 6 nm TSMC process. The "X" in the name indicates the overclocking capabilities of the CPU.

The new Zen 3+ is a refresh of the Zen 3 architecture and should not offer a lot of changes. The chip itself however, offers a lot of new features, like support for USB 4 (40 Gbps), PCI-E Gen 4, DDR5-4800MT/s or LPDDR5-6400MT/s, WiFi 6E, Bluetooth LE 5.2, DisplayPort 2, and AV1 decode.

A big novelty is the integrated GPU Radeon 680M, that is now based on the RDNA2 architecture and offers 12 CUs at up to 2.4 GHz. It should be the fastest iGPU of all at the time of announcement.

Performance

The average 6900HX in our database edges out the Core i7-12800H just slightly while, a little disappointingly, not quite managing to leave the 6900HS behind in the dust. Don't get us wrong; this is still a brilliant CPU for your demanding apps and games, as of late 2022. It does lag behind some of the 12th generation Intel Core i9 options, though.

Thanks to its decent cooling solution and a long-term CPU power limit of nearly 90 W, the XMG Neo 15 2022 is among the fastest laptops built around the 6900HX that we know of. It can be at least 20% faster in CPU-bound workloads than the slowest system featuring the same chip in our database, as of August 2023.

Power consumption

This Ryzen 9 series chip has a default TDP, also known as the long-term power limit, of 45 W with the letter "X" indicating that the user is officially allowed to overclock the thing - leading to an increase in power consumption levels. Either way, a high-performance cooling solution is a must for a CPU like this.

The R9 6900HX is built with TSMC's 6 nm process making for very good, as of early 2023, energy efficiency.

Intel Core i3-7100H

The Intel Core i3-7100H is a dual-core processor for notebooks based on the Kaby Lake architecture and was announced in January 2017. It is probably based on the quad-core die from the other H-series processor with two deactivated cores considering the TDP and the integrated HD Graphics 630. The two CPU cores run at 3GHZ without a Turbo, and the processor can execute up to four threads simultaneously thanks to Hyper Threading. It is also equipped with an Intel HD Graphics 630 GPU, a dual-channel memory controller (DDR4) as well as VP9 and H.265 video decoding as well as encoding. The chip is still manufactured in a 14nm process with FinFET transistors.

Architektur

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Compared to the similarly branded, but much more efficient Core i3-7100U (2.4 GHz, 15-Watt TDP), the i3-7100H has much higher clocks and the performance is almost on par with theCore i5-7200U (2.5-3.1 GHz).

Graphics

The integrated Intel HD Graphics 630 has 24 Execution Units (similar to previous HD Graphics 530) running at 350 - 950 MHz in this case. The performance depends a lot on the memory configuration. Compared to HD 620 GPUs, the higher TDP could result in better sustained performance.

Contrary to Skylake, Kaby Lake now supports hardware decoding for H.265/HEVC Main 10 with a 10-bit color depth as well as Google's VP9 codec. The dual-core Kaby Lake processors, which were announced in January, should also support HDCP 2.2.

Power Consumption

The chip is manufactured in an improved 14nm process with FinFET transistors, which improves the efficiency even further. The TDP is pretty high for a dual-core processor at 35 Watts, so the CPU is not suited fpr thin and light notebooks (where the i3-7100U comes into play).