Intel Core i7-7Y75 vs AMD Ryzen 5 3500U vs Intel Celeron 3867U

Intel Core i7-7Y75

The Intel Core i7-7Y75 is a very efficient dual-core SoC for tablets and passively cooled notebooks based on the Kaby Lake architecture and was announced in the end of August 2016. The CPU consists of two processor cores clocked at 1.3-3.6 GHz (2-core Turbo not specified yet). Thanks to Hyper Threading, the processor can execute up to four threads simultaneously. The chips also includes the Intel HD Graphics 615 GPU, a dual-channel memory controller (DDR3L/LPDDR3) as well as VP9 and H.265 video de- and encoder. It is still produced in a 14 nm process with FinFET transistors. 

Architecture

Intel basically used the familiar micro architecture from the Skylake generation, so the per-MHz performance is identical. Only the Speed-Shift technology for faster dynamic adjustments of the voltages and clocks was improved, and the matured 14 nm process now also enables much higher frequencies and better efficiency than before. 

Performance

Despite the changed designation, the Core i7-7Y75 is the successor to the Core m7-6Y75 (Skylake Y-series), so the chip does not reach the performance level of other Core i processors due to the lower TDP. Thanks to its high Turbo clock, the 7Y75 can sometimes keep up with the 15 Watt models for short peak load and single-thread scenarios, but the clocks will drop significantly under sustained workloads. The CPU is still suitable for many more demanding applications as well as multitasking. 

Graphics

The integrated Intel HD Graphics 615 GPU has 24 Execution Units (EUs) like the old HD Graphics 515 and runs with clocks between 300 and 1050 MHz in combination with this processor. The performance heavily depends on the TDP limit as well as the memory configuration; with fast LPDDR3-1866 RAM in dual-channel mode, the GPU should sometimes be able to compete with the HD Graphics 520, but can also be much slower in other scenarios. Modern games from 2016 will, if at all, only run smoothly in the lowest settings.

Contrary to Skylake, Kaby Lake now also supports hardware decoding for H.265/HEVC Main10 with a 10-bit color depth as well as Google's VP9 codec.

Power Consumption

The chip is manufactured in an improved 14 nm process with FinFET transistors, so the power efficiency was once again improved significantly. The typical TDP for the Y-series is specified at 4.5 Watts, and can be adjusted in both directions depending on the usage scenario.

AMD Ryzen 5 3500U

The AMD Ryzen 5 3500U is a mobile SoC that was announced in January 2019. It combines four Zen+ cores (8 threads) clocked at 2.1 GHz to 3.7 GHz with a Radeon RX Vega 8 iGPU with 8 CUs (512 Shaders) clocked at up to 1200 MHz. Specified at 15 Watt TDP, the SoC is intended for thin mid-range laptops. In Chromebooks, AMD calles the APU AMD Ryzen 5 3500C, but the specifications (and performance) are the same.

The Picasso SoC uses the Zen+ microarchitecture with slight improvements that should lead to a 3% IPS (performance per clock) improvements. Furthermore, the 12 nm process allows for higher clocks at similar power consumption.

The integrated dual-channel memory controller supports up to DDR4-2400 memory. As the features of the Picasso APUs are the same compared to the Raven Ridge predecessors, we point to our Raven Ridge launch article.

Performance

The average 3500U in our database matches the Intel Core i7-1065G7 in multi-thread performance to be an OK lower mid-range option, as of early 2021.

The Honor MagicBook 14 is among the fastest laptops powered by the 3500U that we know of. It can be up to 50% faster in CPU-bound workloads than the slowest system featuring the same chip in our database, as of August 2023.

Power consumption

This Ryzen 5 series chip has a default TDP (also known as the long-term power limit) of 15 W, a value that laptop makers are free to set to anything between 12 W and 35 W with clock speeds and performance changing accordingly as a result. Either way, this is a tad too high to allow for passively cooled designs.

The chip is manufactured on a 12 nm process for subpar, as of late 2022, energy efficiency.

Intel Celeron 3867U

The Intel Celeron 3865U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores clocked at 1.8 GHz (no Turbo Boost, no HyperThreading), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Compared to the similar Celeron 3865, the 3867 offers a different cTDP-down option (12.5 versus 10 Watt).

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Due to the missing Turbo Boost and the low clock speeds, especially the single thread performance is very limited which results in a lower performance even for lower demanding tasks. The performance should be noticeably slower than the Celeron 3965 which offers 400 MHz higher clocked CPU cores. Therefore, the CPU is only suited for entry level tasks like office, web surfing and multimedia.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 900 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.