AMD Ryzen 5 5600U vs Intel Core i3-7100H vs Intel Pentium Gold 4415U

AMD Ryzen 5 5600U

The AMD Ryzen 5 5600U, not to be confused with Intel's Core i7-5600U, is a fairly fast Cezanne family processor designed for use in thinner, lighter laptops. The R5 5600U integrates six of the eight cores based on the Zen 3 microarchitecture and is the third fastest U-series processor at launch. The cores are clocked at 2.3 (guaranteed base clock) to 4.2 GHz (Turbo) and support SMT for a total of 12 threads. The chip is manufactured on the modern 7 nm TSMC process.

The new Zen 3 microarchitecture offers a significantly higher IPC (instructions per clock) compared to Zen 2. For desktop processors AMD claims 19 percent on average and in applications reviews showed around 12% gains at the same clock speed.

In addition to the six CPU cores, the APU also integrates a Radeon RX Vega 7 integrated graphics card with 7 CUs at up to 1800 MHz. The dual channel memory controller supports DDR4-3200 and energy efficient LPDDR4-4266 RAM. Furthermore, 16 MB level 3 cache (up from 8 MB at the 4800U) can be found on the chip.

Performance

This Ryzen 5 series chip is a solid mid-range CPU, as of early 2022. Its multi-thread benchmark scores nearly match those of the Intel Core i5-11400H (a much more power-hungry hexa-core chip designed for use in gaming laptops). While not nearly as fast as 12th generation Alder Lake-P processors, the 5600U should be good enough for the vast majority of users.

Thanks to its decent cooling solution and a long-term CPU power limit of 30 W, the IdeaPad 5 Pro 14ACN6 is among the fastest laptops powered by the 5600U that we know of. It can be more than 30% faster in CPU-bound workloads than the slowest system featuring the same chip in our database, as of August 2023.

Power consumption

This Ryzen 5 has a default TDP of 15 W, a value that laptop makers are allowed to change to anything between 10 W and 25 W with clock speeds and performance changing accordingly as a result. By going for the lowest value possible, it is possible to build a passively cooled system around this chip. Most laptop makers, however, will do the opposite to maximize performance.

The AMD Ryzen 5 5600U is built with TSMC's 7 nm manufacturing process for average, as of mid 2023, energy efficiency.

Intel Core i3-7100H

The Intel Core i3-7100H is a dual-core processor for notebooks based on the Kaby Lake architecture and was announced in January 2017. It is probably based on the quad-core die from the other H-series processor with two deactivated cores considering the TDP and the integrated HD Graphics 630. The two CPU cores run at 3GHZ without a Turbo, and the processor can execute up to four threads simultaneously thanks to Hyper Threading. It is also equipped with an Intel HD Graphics 630 GPU, a dual-channel memory controller (DDR4) as well as VP9 and H.265 video decoding as well as encoding. The chip is still manufactured in a 14nm process with FinFET transistors.

Architektur

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Compared to the similarly branded, but much more efficient Core i3-7100U (2.4 GHz, 15-Watt TDP), the i3-7100H has much higher clocks and the performance is almost on par with theCore i5-7200U (2.5-3.1 GHz).

Graphics

The integrated Intel HD Graphics 630 has 24 Execution Units (similar to previous HD Graphics 530) running at 350 - 950 MHz in this case. The performance depends a lot on the memory configuration. Compared to HD 620 GPUs, the higher TDP could result in better sustained performance.

Contrary to Skylake, Kaby Lake now supports hardware decoding for H.265/HEVC Main 10 with a 10-bit color depth as well as Google's VP9 codec. The dual-core Kaby Lake processors, which were announced in January, should also support HDCP 2.2.

Power Consumption

The chip is manufactured in an improved 14nm process with FinFET transistors, which improves the efficiency even further. The TDP is pretty high for a dual-core processor at 35 Watts, so the CPU is not suited fpr thin and light notebooks (where the i3-7100U comes into play).

Intel Pentium Gold 4415U

The Intel Pentium 4415U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.3 GHz (no Turbo Boost), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Compared to the more expensive Core i3-7100U, the 4415U offers a similar CPU performance (2.3 versus 2.4 GHz) and less level 3 cache but a slower integrated graphics card. Still, the CPU has sufficient power for office and multimedia purposes as well as somewhat more demanding applications.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 950 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.