AMD Ryzen 7 4700U vs Intel Core i5-7267U vs Intel Pentium Gold 4415U

AMD Ryzen 7 4700U

The AMD Ryzen 7 4700U is a processor for thin and light laptops based on the Renoir architecture. The 4700U integrates all eight cores based on the Zen 2 microarchitecture. They are clocked at 2 (guaranteed base clock) to 4.1 GHz (Turbo). There is no support for the thread-doubling SMT tech. The chip is manufactured on the modern 7 nm TSMC process and partly thanks to it AMD advertises a 2x improved performance per Watt for the Renoir chips. Compared to the faster R7 4800U, the 4700U offers slightly lower clock speeds and no support for SMT / Hyperthreading.

In addition to the eight CPU cores, the APU also integrates a Radeon RX Vega 7 integrated graphics card with 7 CUs and up to 1600 MHz. The dual channel memory controller supports DDR4-3200 and energy efficient LPDDR4-4266 RAM. Furthermore, 8 MB level 3 cache can be found on the chip. See our hub page on the Renoir Processors for more information.

Performance

The average 4700U in our database proves to be a rather competent little processor. It trades blows with the much more power-hungry Intel Core i7-10750H, as far as multi-thread benchmark scores are concerned. While it fails to get far enough away from the more affordable Ryzen 5 4600U, this Ryzen 7 is still a good CPU for most tasks.

Your mileage may vary depending on how competent the cooling solution of your laptop is and how high the CPU power limits are.

Power consumption

The Ryzen 7 4700U is a 15 W chip. However, laptop makers are allowed to change that value to anything between 10 W and 25 W, with clock speeds and long-term performance changing accordingly as a result. By going for the lowest value, it is possible to build a passively cooled system around the APU.

The fairly modern 7 nm TSMC process this Ryzen is manufactured on makes for above average, as of mid 2022, energy efficiency.

Intel Core i5-7267U

The Intel Core i5-7267U is a fast dual-core SoC for notebooks based on the Kaby Lake architecture and was announced in January 2017. The CPU has two processor cores clocked at 3.1-3.5 GHz (two cores also up to 3.5 GHz). The processor can execute up to four threads simultaneously thanks to Hyper Threading. It is also equipped with an Intel Iris Plus Graphics 650 GPU with 64 MB eDRAM, a dual-channel memory controller (DDR4) as well as VP9 and H.265 video decoding as well as encoding. The chip is still manufactured in a 14nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

The performance of the 28-Watt CPU should be on par with the Core i7-7500U (2.7-3.5 GHz, no eDRAM, 15 Watts), but it should be a bit slower on practice due to the missing level 4 eDRAM and the lower TDP. This means the i5 is still one of the faster dual-core processors and should be sufficient for most scenarios. Some games might still require a real quad-core processor and therefore nit run perfectly on the dual-core processor, despite Hyper Threading.

Graphics

The integrated Intel Iris Plus 650 Graphics is the GT3e model of the Kaby Lake GPU (Intel Gen. 9.5). It has 48 Execution Units running at 300-1050 MHz and the performance is comparable to a GeForce 920MX thanks to fast eDRAM cache. However, there aren't any significant improvements compared to the old Iris Pro 550, so modern games can often not be played smoothly or only at the lowest or medium settings, respectively.

Contrary to Skylake, Kaby lake now also supports H.265/HEVC Main 10 with a 10-bit color depth as well as Google's VP9 codec. The dual-core Kaby Lake processors announced in January should also support HDCP 2.2.

Power Consumption

The chip is manufactured in an improved 14nm process with FinFET transistors, which improves the efficiency even further. Intel specifies the TDP with 28 Watts, which can be reduced to 23 Watts (cTDP Down) depending on the usage scenario. The TDP is pretty high compared to the common 15-Watt TDP for dual-core processors, but allows a better utilization of CPU and GPU Turbo.

Intel Pentium Gold 4415U

The Intel Pentium 4415U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.3 GHz (no Turbo Boost), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Compared to the more expensive Core i3-7100U, the 4415U offers a similar CPU performance (2.3 versus 2.4 GHz) and less level 3 cache but a slower integrated graphics card. Still, the CPU has sufficient power for office and multimedia purposes as well as somewhat more demanding applications.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 950 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.