Intel Celeron 3867U vs AMD Ryzen 9 5900HX vs Intel Xeon E3-1505M v6

Intel Celeron 3867U

The Intel Celeron 3865U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores clocked at 1.8 GHz (no Turbo Boost, no HyperThreading), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Compared to the similar Celeron 3865, the 3867 offers a different cTDP-down option (12.5 versus 10 Watt).

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Due to the missing Turbo Boost and the low clock speeds, especially the single thread performance is very limited which results in a lower performance even for lower demanding tasks. The performance should be noticeably slower than the Celeron 3965 which offers 400 MHz higher clocked CPU cores. Therefore, the CPU is only suited for entry level tasks like office, web surfing and multimedia.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 900 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.

AMD Ryzen 9 5900HX

The AMD Ryzen 9 5900HX is a processor for big (gaming) laptops based on the Cezanne generation. The R9 5900H integrates all eight cores based on the Zen 3 microarchitecture. They are clocked at 3.3 (guaranteed base clock) to 4.6 GHz (Turbo) and support SMT for a total of 16 threads. The chip is manufactured on the modern 7 nm TSMC process. The "X" in the name indicates the overclocking capabilities of the CPU.

The new Zen 3 microarchitecture offers a significantly higher IPC (instructions per clock) compared to Zen 2. For desktop processors AMD claims 19 percent on average and in applications reviews showed around 12% gains at the same clock speed.

In addition to the eight CPU cores, the APU also integrates a Radeon RX Vega 8 integrated graphics adapter with 8 CUs and up to 2100 MHz. The dual channel memory controller supports DDR4-3200 and energy efficient LPDDR4-4266 RAM. Furthermore, 16 MB level 3 cache can be found on the chip.

Performance

The average 5900HX in our database trades blows with Intel's Core i9-11980HK, as far as multi-thread benchmark scores are concerned. While not much faster than the less power-hungry Ryzen 9 5900HS, this is still a great CPU for quality gaming laptops as well as DTRs and high-performance mini-PCs, as of mid 2022.

Thanks to its decent cooling solution and a long-term CPU power limit of 80 W, the Strix Scar 17 G733QSA-XS99 is among the fastest laptops powered by the 5900HX that we know of. It can be roughly 15% faster in CPU-bound workloads than the slowest system featuring the same chip in our database, as of August 2023.

Power consumption

This Ryzen 9 series chip has a default TDP (also known as the long-term power limit) of 45 W, a value that laptop makers are allowed to change to anything between 35 W and 54 W with clock speeds and performance changing accordingly as a result. Either way, a high-performance cooling solution is a must for a CPU like this.

The R9 5900HX is built with the 7 nm TSMC manufacturing process resulting in decent, as of late 2022, energy efficiency.

Intel Xeon E3-1505M v6

The Intel Xeon E3-1505M v6 is a fast quad-core processor notebooks based on the Kaby Lake architecture and was announced in January 2017. It is the second fastest mobile Xeon model and the performance is slightly better tha the 100 MHz slower clocked consumer Core i7-7820HQ. Compared to the Core processors, the chip also supports ECC-RAM (error correction). Besides four cores including Hyper-Threading support running at 3 - 4 GHz (4 cores up to 3.6 GHz, 2 cores up to 3.8 GHz), the processor is also equipped with the professional HD Graphics P630 GPU as well as a dual-channel memory controller (DDR3L-1600/DDR4-2400). It is manufactured in a 14nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Thanks to the higher clocks, even the smaller model of the mobile Xeons is ahead of the fastest Skylake models (Xeon E3-1575M v6) and is therefore als powerful enough for very demanding applications.

Graphics

The integrated professional Intel HD Graphics P630 has 24 Execution Units (similar to previous HD Graphics 530) running at 350 - 1100 MHz. The performance depends a lot on the memory configuration; it should be comparable to a dedicated Nvidia GeForce 920M in combination with fast DDR4-2133 dual-channel memory. It offers certified drivers for 15 professional and CAD applications.

Contrary to Skylake, Kaby Lake now supports hardware decoding for H.265/HEVC Main 10 with a 10-bit color depth as well as Google's VP9 codec. The dual-core Kaby Lake processors, which were announced in January, should also support HDCP 2.2.

Power Consumption

The chip is manufactured in an improved 14nm process with FinFET transistors, which improves the efficiency even further. Intel still specifies the TDP with 45 Watts, but it can also be reduced to 35 Watts by the notebook manufacturers (cTDP down). This will obviously affect the performance, because the Turbo Boost cannot be maintained for longer periods.