Intel Xeon W-11855M
The Intel Xeon W-11855M is a high end hexa core SoC for laptops and mobile workstations. It is based on the Tiger Lake H45 generation and was announced in mid 2021. It integrates six Willow Cove processor cores (12 threads thanks to HyperThreading). The base clock speed depends on the TDP setting and at 45 Watt is at 3.2 GHz. The single and dual core boost speed can reach up to 4.9 GHz (using ITBM 3.0), all cores can reach up to 4.4 GHz. The CPU offers 18 MB level 3 cache and supports DDR4-3200 memory.
The Xeon W-11855M is the fastest 6-core CPU of the Tiger Lake line-up at launch and should easily best the older 6 core CPUs thanks to the high clock speeds and the new architecture. Therefore, the Xeon is well suited for even very demanding tasks and is only bested by the 8-core CPUs like the W-11955M.
The SoC also included the improved Xe graphics card called UHD graphics with all 32 EUs.
Furthermore, Tiger Lake SoCs add PCIe 4 support (20 lanes in the H45 series), AI hardware acceleration, and the partial integration of Thunderbolt 4/USB 4 and Wi-Fi 6E in the chip.
The chip is produced on the improved 10nm process (called 10nm SuperFin) at Intel, which should be comparable to the 7nm process at TSMC (e.g. Ryzen 4000 series). The default TDP is rated at 45 W at 3.2 GHz base speed, at 35 Watt the base clock speed decreases to 2.6 GHz (cTDP down).
All articles on Tiger Lake can be found on our Tiger Lake architecture hub.
Series | Intel Tiger Lake | ||||||||||||||||||||||||||||||||||||||||
Codename | Tiger Lake-H | ||||||||||||||||||||||||||||||||||||||||
Series: Tiger Lake Tiger Lake-H
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Clock Rate | 3200 - 4900 MHz | ||||||||||||||||||||||||||||||||||||||||
Level 1 Cache | 480 KB | ||||||||||||||||||||||||||||||||||||||||
Level 2 Cache | 7.5 MB | ||||||||||||||||||||||||||||||||||||||||
Level 3 Cache | 18 MB | ||||||||||||||||||||||||||||||||||||||||
Number of Cores / Threads | 6 / 12 | ||||||||||||||||||||||||||||||||||||||||
Power Consumption (TDP = Thermal Design Power) | 45 Watt | ||||||||||||||||||||||||||||||||||||||||
Manufacturing Technology | 10 nm | ||||||||||||||||||||||||||||||||||||||||
Max. Temperature | 100 °C | ||||||||||||||||||||||||||||||||||||||||
Socket | BGA1787 | ||||||||||||||||||||||||||||||||||||||||
Features | DDR4-3200 RAM (incl. ECC), PCIe 4, 8 GT/s bus, DL B., GNA, vPro, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, BMI2, ABM, FMA, ADX, VMX, SMEP, SMAP, EIST, TM1, TM2, HT, Turbo, SST, AES-NI, RDRAND, RDSEED, SHA | ||||||||||||||||||||||||||||||||||||||||
GPU | Intel UHD Graphics Xe 32EUs (Tiger Lake-H) (350 - 1450 MHz) | ||||||||||||||||||||||||||||||||||||||||
64 Bit | 64 Bit support | ||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | ||||||||||||||||||||||||||||||||||||||||
Announcement Date | 05/11/2021 | ||||||||||||||||||||||||||||||||||||||||
Product Link (external) | ark.intel.com |