AMD Ryzen 5 5600H vs Intel Core i5-7Y57 vs Intel Celeron 3965U

AMD Ryzen 5 5600H

The AMD Ryzen 5 5600H is a processor for big (gaming) laptops based on the Cezanne generation. The R5 5600H has six of the eight cores based on the Zen 3 microarchitecture. They are clocked at 3.3 GHz (guaranteed base clock) to 4.2 GHz (Turbo) and support SMT for a total of 12 threads. The chip is manufactured on the modern 7 nm TSMC process.

The new Zen 3 microarchitecture offers a significantly higher IPC (instructions per clock) compared to Zen 2. For desktop processors AMD claims 19 percent on average and in applications reviews showed around 12% gains at the same clock speed.

In addition to the six CPU cores, the APU also integrates a Radeon RX Vega 7 integrated graphics processor with 7 CUs running at up to 1800 MHz. The dual channel memory controller supports DDR4-3200 and energy efficient LPDDR4-4266 RAM. Furthermore, 16 MB of L3 cache can be found on the chip.

Performance

The average 5600H in our database is in the same league as the Ryzen 5 6600HS and the Core i7-1260P, as far as multi-thread benchmark scores are concerned.

Thanks to its decent cooling solution and a long-term CPU power limit of 45 W, the Lenovo Legion 5 17 is among the fastest laptops powered by the 5600H that we know of. It can be roughly 30% faster in CPU-bound workloads than the slowest system featuring the same chip in our database, as of August 2023.

Power consumption

This Ryzen 5 series chip has a default TDP (also known as the long-term power limit) of 45 W, a value that laptop makers are allowed to change to anything between 35 W and 54 W with clock speed and performance changing accordingly as a result. A high-performance cooling solution is a must for a CPU like this.

The hexa-core APU is built with the 7 nm TSMC process for decent, as of late 2022, energy efficiency.

Intel Core i5-7Y57

The Intel Core i5-7Y57 is a very efficient dual-core SoC for tablets and passively cooled notebooks based on the Kaby Lake architecture and was announced in the Q1/2017. It is a slightly faster version of the Core i5-7Y54 (1.2-3.2 GHz). The CPU consists of two processor cores clocked at 1.2-3.3 GHz (2-core Turbo 2.9 GHz). Thanks to Hyper Threading, the processor can execute up to four threads simultaneously. The chips also includes the Intel HD Graphics 615 GPU, a dual-channel memory controller (DDR3L/LPDDR3) as well as VP9 and H.265 video de- and encoder. It is still produced in a 14 nm process with FinFET transistors. 

Architecture

Intel basically used the familiar micro architecture from the Skylake generation, so the per-MHz performance is identical. Only the Speed-Shift technology for faster dynamic adjustments of the voltages and clocks was improved, and the matured 14 nm process now also enables much higher frequencies and better efficiency than before. 

Performance

Despite the changed designation, the Core i5-7Y57 is the successor to the Core m5-6Y57 (Skylake Y-series), so the chip does not reach the performance level of other Core i processors due to the lower TDP. Thanks to its high Turbo clock, the 7Y57 can sometimes keep up with the 15 Watt models for short peak load and single-thread scenarios, but the clocks will drop significantly under sustained workloads. The CPU is still suitable for many more demanding applications as well as multitasking. 

Graphics

The integrated Intel HD Graphics 615 GPU has 24 Execution Units (EUs) like the old HD Graphics 515 and runs with clocks between 300 and 950 MHz in combination with this processor. The performance heavily depends on the TDP limit as well as the memory configuration; with fast LPDDR3-1866 RAM in dual-channel mode, the GPU should sometimes be able to compete with the HD Graphics 520, but can also be much slower in other scenarios. Modern games from 2016 will, if at all, only run smoothly in the lowest settings.

Contrary to Skylake, Kaby Lake now also supports hardware decoding for H.265/HEVC Main10 with a 10-bit color depth as well as Google's VP9 codec.

Power Consumption

The chip is manufactured in an improved 14 nm process with FinFET transistors, so the power efficiency was once again improved significantly. The typical TDP for the Y-series is specified at 4.5 Watts, and can be adjusted in both directions depending on the usage scenario.

Intel Celeron 3965U

The Intel Celeron 3965U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores without Hyper-Threading clocked at 2.2 GHz (no Turbo Boost), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Due to the missing Turbo Boost and the low clock speeds, especially the single thread performance is very limited which results in a lower performance even for lower demanding tasks. The performance should be between the Intel Pentium 4405U and 4415U. Still, the CPU has sufficient power for office and multimedia purposes.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 900 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.