Intel Core i3-1115G4 vs MediaTek Dimensity 800 vs MediaTek Dimensity 810

Intel Core i3-1115G4

The Intel Core i3-1115G4 is a dual-core SoC for laptops and Ultrabooks based on the Tiger Lake-U generation (UP3) that was launched in September 2020. It integrates two Willow Cove processor cores (4 threads thanks to HyperThreading). Each core can clock from 3 GHz (base speed) to 4.1 GHz (single- and dual-core boost). The faster Core i5 and i7 models offer more cores and are therefore significantly faster.

Another novelty is the integrated Xe graphics card based on the completely new Gen 12 architecture. In the i3-1115G4 Intel is naming the GPU UHD Graphics and offers only 48 of the 96 EUs clocked at 400 - 1250 MHz. GPU and CPU can together use the 6 MB of L3 cache.

Furthermore, Tiger Lake SoCs add PCIe 4 support (four lanes), AI hardware acceleration, and the partial integration of Thunderbolt 4 / USB 4 and WiFi 6 in the chip.

The chip is produced on the second-gen 10 nm Intel SuperFin process that should be comparable to the 7 nm TSMC process (e.g. Ryzen 4000 series).

Performance

Multi-thread peformance is most comparable to what the Intel Core i5-8250U and the AMD Ryzen 5 3450U deliver. This makes the i3 a more than decent option for day-to-day tasks; that said, any workload of the more taxing kind (such as exporting a high-bitrate, hour long UHD video) will be enough to bring the i3 to its knees.

Thanks to its decent cooling solution and a long-term CPU power limit of 25 W, the ThinkPad L15 G2-20X4S0KU00 is one of the fastest laptops powered by the 1115G4 we know of. It can be more than 20% faster in CPU-bound workloads than the slowest system featuring the same chip in our database, as of August 2023.

Power consumption

This Core i3 series chip has a default TDP of 12 W to 28 W, the expectation being that laptop makers will go for a higher value in exchange for higher performance. Either way, that's a tad too high to allow for passively cooled laptops, tablets, mini-PCs.

The Core i3-1115G4 is built with Intel's third-gen 10 nm process marketed as SuperFin for decent, as of mid 2022, energy efficiency.

MediaTek Dimensity 800

The Mediatek Dimensity 800 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G57 MC4 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.

Compared to the similar named Dimensity 800U, the 800 offers two more big A76 cores but clocked 400 MHz lower. This means the single core performance is lower, but the multi-core performance can be better.

The Dimensity 800 is manufactured in the modern 7nm process and should be very power efficient.

MediaTek Dimensity 810

The Mediatek Dimensity 810 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.

The integrated 5G modem supports dual-5G (Sub6) with up to 2.77 GBit/s download. 

The Dimensity 800 is manufactured in the modern 6nm process at TSMC and should be very power efficient.