AMD Ryzen 3 2200U vs Intel Pentium Gold 4415U vs Intel Xeon E3-1505M v6

AMD Ryzen 3 2200U

The AMD Ryzen 3 2200U is a mobile APU for thin and light laptops that was announced in October 2017. It includes two Zen cores clocked at 2.5 to 3.4 GHz and offers SMT (four threads at once) and 4 MB L3-Cache. The integrated graphics card is called Radeon RX Vega 3 and offers only 3 CUs (192 Shaders) clocked at up to 1000 MHz. The TDP is configurable between 12 and 25 Watt (15 Watt nominal).

More information on Raven Ridge can be found in our launch article.

Intel Pentium Gold 4415U

The Intel Pentium 4415U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.3 GHz (no Turbo Boost), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Compared to the more expensive Core i3-7100U, the 4415U offers a similar CPU performance (2.3 versus 2.4 GHz) and less level 3 cache but a slower integrated graphics card. Still, the CPU has sufficient power for office and multimedia purposes as well as somewhat more demanding applications.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 950 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.

Intel Xeon E3-1505M v6

The Intel Xeon E3-1505M v6 is a fast quad-core processor notebooks based on the Kaby Lake architecture and was announced in January 2017. It is the second fastest mobile Xeon model and the performance is slightly better tha the 100 MHz slower clocked consumer Core i7-7820HQ. Compared to the Core processors, the chip also supports ECC-RAM (error correction). Besides four cores including Hyper-Threading support running at 3 - 4 GHz (4 cores up to 3.6 GHz, 2 cores up to 3.8 GHz), the processor is also equipped with the professional HD Graphics P630 GPU as well as a dual-channel memory controller (DDR3L-1600/DDR4-2400). It is manufactured in a 14nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Thanks to the higher clocks, even the smaller model of the mobile Xeons is ahead of the fastest Skylake models (Xeon E3-1575M v6) and is therefore als powerful enough for very demanding applications.

Graphics

The integrated professional Intel HD Graphics P630 has 24 Execution Units (similar to previous HD Graphics 530) running at 350 - 1100 MHz. The performance depends a lot on the memory configuration; it should be comparable to a dedicated Nvidia GeForce 920M in combination with fast DDR4-2133 dual-channel memory. It offers certified drivers for 15 professional and CAD applications.

Contrary to Skylake, Kaby Lake now supports hardware decoding for H.265/HEVC Main 10 with a 10-bit color depth as well as Google's VP9 codec. The dual-core Kaby Lake processors, which were announced in January, should also support HDCP 2.2.

Power Consumption

The chip is manufactured in an improved 14nm process with FinFET transistors, which improves the efficiency even further. Intel still specifies the TDP with 45 Watts, but it can also be reduced to 35 Watts by the notebook manufacturers (cTDP down). This will obviously affect the performance, because the Turbo Boost cannot be maintained for longer periods.