Xiaomi Redmi K50 Pro, Realme GT Neo 3, and potential OnePlus Nord 3 announced with the new MediaTek Dimensity 8100 chipset
MediaTek launched its new Dimensity 8000-series chipsets today: the Dimensity 8100 and Dimensity 8000. The Dimensity 8100, as reported earlier, will be the SoC to enjoy wide adoption and has now been confirmed to feature on smartphones from Xiaomi, Realme, OPPO, and OnePlus.
Xiaomi has announced that the Dimensity 8100 will power its Redmi K50 series. The company doesn't specify which device will get the Dimensity 8100 but all available information leans towards the Redmi K50 Pro sporting the chipset, with the range-topping Redmi K50 Pro+ to get the more powerful Dimensity 9000. Lu Weibing, General Manager of Redmi, has also confirmed that the phone will make its debut this month.
In addition to Xiaomi, Realme also confirmed the Dimensity 8100 for the upcoming Realme GT Neo 3, while touting the phone's 150 W fast charging capabilities. OnePlus will join as well, as it also announced its plans to release an unspecified device with the Dimensity 8100. Word on the grapevine leans towards that phone being the OnePlus Nord 3. The Nord 2 debuted with the Dimensity 1200—MediaTek's most powerful chipset at the time.
Lastly, OPPO will adopt the Dimensity 8000, not the Dimensity 8100. The company announced that the less powerful of the two chips will appear on the upcoming OPPO K10 series, as well as a partnership with MediaTek for better gaming performance.