MediaTek unveils the new Dimensity 1300 SoC for next-gen mid-range 5G smartphones

MediaTek has just announced the Dimensity 8000 and 8100 processors that might start to appear in new 5G phones soon. The OEM has now also now revealed that it has prepared the 6nm 1300 to go with them, which has much in common with the new sub-flagship products, and may also ring some Kompanio bells in more ways than one.

However, it is apparent that the Taiwanese firm might target devices of perhaps the next tier down with the direct 1200 successor. It, like the 8000 series, is made up of 4 Cortex-A78 cores and 4 A55 cores. However, it takes a slightly more traditional approach to them: 1 of the A78s is the only "Ultra" core clocked at 3.0GHz, whereas the others are 2.6GHz and the A55s are clocked at 2.0GHz.

The 1300 also features the well-worn ARM Mali-G77 MC9 GPU, and will support up to 16GB of LPDDR4x RAM and UFS 3.1 flash storage. Then again, it has launched with a maximum possible refresh rate of 168Hz. This spec is joined by the MediaTek HyperEngine 5.0 gaming engine; Miravision for video -  with AV1 support - and a third-gen APU.

The new MediaTek chipset is also rated to support 200MP image sensors - so long as there is just one of them. The OEM also touts the 1300 as capable of improved low-light photography thanks to its Imagiq AI-assisted platform, as well as 4K HDR Video with 3-Exposure Fusion for dynamic range enhancements of up to 40%.

Finally, the new processor is rated for integrated 5G with 4×4 MIMO, as well as 2×2 Wi-Fi 6 and Bluetooth 5.2. Therefore, the Dimensity 1300 SoC could emerge soon as the platform for new mobile devices that might need one or more ways to stand out in the mid-range space.