Leaked MediaTek Dimensity 1300T specs point to a new Snapdragon 865-beating chipset with an imminent launch
MediaTek is now linked to a closely-impending launch for the Dimensity 1300T, an alleged new SoC on which relatively little is known thus far. However, MyDrivers now claims to expand on this subject much more extensively with a range of promising-looking specs apparently associated with the chipset.
For a start, the blog reiterates an earlier hint at the same updated 6nm nature found in the existing 1200 and 1100. However, the 1300T is also now apparently destined for at least 1 Cortex-A78 core, although its clock-speed remains a mystery.
Nevertheless, the 1300T may come with the same 9-core ARM Mali-G77 MC9 GPU as the 1200, as well as a 6-core third-gen APU. It might also feature the latest version of its maker's HyperEngine game optimization engine. MyDrivers goes as far to assert that these specs will confer no less than 82% more AI performance compared to the Snapdragon 865.
The blog also claims that the 1300T will boost its CPU and GPU performance by 30% and 40% respectively compared to the "previous generation" (although it does not specify which generation this is). All in all, MyDrivers projects these specs might lift the putative 1300T above the 865, if not its iterative upgrade the 870.
Therefore, the new Dimensity variant is shaping up as a new MediaTek flagship for mid- to late-2021. Then again, Qualcomm touts the apparently competing 870 as suitable for tablets as well as phones, whereas the 1300T is slated as specifically geared toward the former category.
It is believed to debut in a device called the Honor V7 Pro, a slate that, according to its latest leak, will combine a slim-bezel display free of punch-holes or similar selfie-cam-related intrusions with its potentially high-end chassis. Its launch date remains unknown, whereas the Dimensity 1300T may be revealed as early as July 26, 2021.