Intel Core i3-6006U vs Intel Pentium Silver N5000 vs Intel Core i3-6157U
Intel Core i3-6006U
► remove from comparisonThe Intel Core i3-6006U is an ULV (ultra low voltage) dual-core SoC based on the Skylake architecture and has been launched in November 2016. The CPU can be found in small and light notebooks. In addition to two CPU cores with Hyper-Threading clocked at (rather low) 2 GHz (no Turbo Boost), the chip also integrates an HD Graphics 520 GPU (clocked at only 900 MHz) and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.
Architecture
Skylake replaces both Haswell and Broadwell and brings the same microarchitecture in every TDP class from 4.5 to 45 W. The extensive improvements of the Skylake design include increased out-of-order buffers, optimized prefetching and branch prediction as well as additional performance gains through Hyper-Threading. Overall, however, performance per clock has been increased by only 5 to 10 percent (compared to Haswell) respectively under 5 percent (compard to Broadwell), which is quite modest for a new architecture ("Tock").
Performance
According to the specified clock rates and the improved architecture, the Core i3-6100U should perform slightly above the similar clocked Core i5-5005U of the Broadwell architecture. Thus, the CPU has sufficient power for office and multimedia purposes as well as more demanding applications and light multitasking.
Graphics
The integrated graphics unit called HD Graphics 520 represents the "GT2" version of the Skylake GPU (Intel Gen. 9). The 24 Execution Units, also called EUs, are clocked at 300 - 900 MHz and offer a performance somewhere in range of a dedicated GeForce 820M. Games of 2015 can thus be played smoothly in low settings. For more information about performance and features, check our page for the HD Graphics 520. Clocked at 900 MHz, the i3-6006U features currently the slowest variant of the HD Graphics 520 (clocks up to 1050 MHz in the Core i7 models).
Power Consumption
Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 7.5 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.
Intel Pentium Silver N5000
► remove from comparisonThe Intel Pentium Silver N5000 is a quad-core SoC primarily for inexpensive notebooks and was announced late 2017. It runs at 1.1-2.7 GHz (Single Core Burst, Multi Core Burst max. 2.6 GHz) and is based on the Gemini Lake platform. Similar to the Apollo Lake predecessor, the chip is manufactured in a 14 nm process with FinFETs but offers slightly improved processor cores, double the amount of L2 cache, a smaller package, a new generation of monitor outputs (Gen 10) and a partly integrated WiFi chip. Besides four CPU cores, the chip also includes a DirectX 12 capable GPU as well as a DDR4/LPDDR4 memory controller (dual-channel, up to 2400 MHz). The SoC is not replaceable as it is directly soldered to the mainboard.
Architecture
The processor architecture was slightly reworked and is now called Goldmont Plus. It features an increased level 2 cache (to 4 MB). That means the per-clock-performance should be a bit better, but not near the Core CPUs like Kaby Lake Y.
Performance
The average N5000 in our database is in the same league as the AMD 3050e and the Pentium 4415U, as far as multi-thread benchmark scores are concerned. This is a really poor result, as of Q3 2023.
The Yoga 330-11IGM is among the fastest laptops featuring the N5000 that we know of. It can be more than 30% faster in CPU-bound workloads than the slowest system built around the same chip in our database, as of August 2023.
GPU Performance
The UHD Graphics 605 (Gemini Lake) is based on Intel's Gen9 architecture, which supports DirectX 12 and is also used for the Kaby Lake / Skylake / Apollo Lake graphics adapters (like HD Graphics 520). Equipped with 18 EUs and a clock of up to 750 MHz, the performance should be roughly on par with the older HD Graphics 5300 and HD Graphics 505 (Apollo Lake).
The chip also includes an advanced video engine with hardware support for the playback of VP9 and H.265 material (8-bit color-depth).
Power Consumption
Similar to the predecessor, Intel specifies the TDP with 6 Watts (SDP 4.8 Watts – Scenario Design Power). The chip can therefore be cooled passively in theory, but SKUs with fans are possible as well.
Intel Core i3-6157U
► remove from comparisonThe Intel Core i3-6157U is a dual-core SoC based on the Skylake architecture and has been launched in September 2015. The CPU can be found in medium-sized ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.4 GHz (no Turbo Boost), the chip also integrates an Iris Graphics 550 GPU with 64 MB of eDRAM memory as well as a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.
Architecture
Skylake replaces both Haswell and Broadwell and brings the same microarchitecture in every TDP class from 4.5 to 45 W. The extensive improvements of the Skylake design include increased out-of-order buffers, optimized prefetching and branch prediction as well as additional performance gains through Hyper-Threading. Overall, however, performance per clock has been increased by only 5 to 10 percent (compared to Haswell) respectively under 5 percent (compard to Broadwell), which is quite modest for a new architecture ("Tock").
Furthermore, the organisation of the eDRAM cache has been modified. Instead of acting like a victim cache, which has to be adressed via the L3/LLC, the eDRAM can now be adressed directly by programms just like the main memory. The size is still 128 MB for the quad-core models (4C + GT4e), while the dual-core chips (2C + GT3e) only offer 64 MB.
Performance
According to the specified clock rates and the improved architecture, the Core i3-6157U should perform similar to a Core i3-5157U (Broadwell, 15 W). Thus, the CPU has sufficient power for office and multimedia purposes as well as more demanding applications and multitasking.
Graphics
The integrated graphics unit called Iris Graphics 550 represents the "GT3e" version of the Skylake GPU (Intel Gen. 9). The 48 Execution Units, also called EUs, are clocked at 350 - 1000 MHz and offer (thanks to the fast eDRAM cache) a performance similar to a dedicated GeForce 930M. Games of 2015 can thus be played smoothly in low or medium settings. For more information about performance and features, check our page for the Iris Graphics 550.
Power Consumption
Specified at a TDP of 28 W (including CPU, GPU and memory controller), the CPU is best suited for medium-sized notebooks (13-inches and above). Optionally, the TDP can be lowered to 23 watts (cTDP down), reducing both heat dissipation and performance.
Model | Intel Core i3-6006U | Intel Pentium Silver N5000 | Intel Core i3-6157U | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Intel Core i3 | Intel Gemini Lake | Intel Core i3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Skylake | Gemini Lake | Skylake | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Core i3 Skylake |
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Clock | 2000 MHz | 1100 - 2700 MHz | 2400 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L1 Cache | 128 KB | 224 KB | 128 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L2 Cache | 512 KB | 4 MB | 512 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L3 Cache | 3 MB | 3 MB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 2 / 4 | 4 / 4 | 2 / 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TDP | 15 Watt | 6 Watt | 28 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 14 nm | 14 nm | 14 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Die Size | 99 mm2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
max. Temp. | 100 °C | 105 °C | 100 °C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Socket | BGA | BGA1090 | BGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | Dual-Channel DDR3L-1600/DDR4-2133 Memory Controller, HyperThreading, AVX, AVX2, Quick Sync, Virtualization, AES-NI | DDR4-2400/LPDDR4-2400 RAM, PCIe 2, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SMEP, SMAP, MPX, EIST, TM1, TM2, Turbo, AES-NI, RDRAND, RDSEED, SHA, SGX | Dual-Channel DDR3L-1600/DDR4-2133 Memory Controller, HyperThreading, AVX, AVX2, Quick Sync, Virtualization, AES-NI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | Intel HD Graphics 520 (300 - 900 MHz) | Intel UHD Graphics 605 (200 - 750 MHz) | Intel Iris Graphics 550 (300 - 1000 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | x86 | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
$281 U.S. | $161 U.S. | $304 U.S. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Announced | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | ark.intel.com | ark.intel.com | ark.intel.com |