CES 2023 | MediaTek hypes Wi-Fi 7 uptake trajectory with its latest electronics and industrial partnerships
MediaTek has come to Las Vegas to confirm that its flagship Wi-Fi 7 platform has attracted a number of client OEMs and partners already. The 6nm Filogic 880 chip is officially the one conferring upgrades to 320MHz channels, 4096-QAM modulation and Multi-Link Operation (MLO) aggregation on many other devices from a range of companies at CES 2023.
Lenovo, for example, has confirmed that it will handle the connectivity necessary for the "immersive, high-performance PC gaming experiences" to be delivered with the next generation of the Legion line-up, as has Asus for its own upcoming gaming line-up.
Furthermore, AMD has now indicated its intent to "combine" Wi-Fi 7 modules from MediaTek with Ryzen platforms. Companies such as TP-Link and Buffalo have also announced that they have taken the Filogic 880 up for inclusion in their own latest products.
Therefore, MediaTek's Wi-Fi 7 platforms will have a place in the laptops, routers and streaming devices of the future, as it asserted during the 880's launch. They will also have a role in industry, however, having been chosen by the wireless testing group LitePoint, as well as electronics and semiconductor validation specialists NI.
Finally, Korea Telecom now backs MediaTek Wi-Fi 7 tech to deliver the "throughput" necessary to satisfy next-gen consumer demand for connectivity-driven entertainment and communication.
Source(s)
MediaTek Press Release
