MediaTek Dimensity 7200 SoC debuts to boost gaming and camera performance on next-gen mid-range smartphones
Mediatek's Dimensity 7200 may not be a new flagship-grade SoC; however, it has been made using the same 2nd-gen TSMC 4nm process as the top-end 9200. Then again, its 2 ARM Cortex-A715 cores are the processor's fastest at 2.8GHz, with 6 A510s to complete its core count.
The 7200 chipset also features a Mali-G610 MC4 GPU and an intergrated APU to "maximize the efficiency of AI tasks and AI-fusion processing". MediaTek also highlights its Imagiq 765 image signalling processor (ISP), which works with an additional 14-bit "HDR-ISP" to confer support for 200MP main cameras on the chipset.
The new Dimensity-series member could also be used to make a new FHD+ display smartphone with an up-to-144Hz refresh rate, up to 6,400Mb/s RAM and UFS 3.1 internal storage at a more affordable price-point.
The 7200 also supports up-to-date 3GPP Release-16 standard sub-6GHz 5G modem with a downlink speed of up to 4.7Gb/s, tri-band Wi-Fi 6E and Bluetooth 5.3.
Combining all that in the same device could make for a battery-draining experience - however, MediaTek asserts that the latest, AI-enhanced HyperEngine 5.0 technology with Variable Rate Shading (VRS) and 5G UltraSave 2.0 technology will deal with those risks with "best-in-class" efficiency.
MediaTek projects that the Dimensity 7200 could be on the market in some form by the end of March 2023 at the latest.
MediaTek Press Release