Mediatek Helio G99 vs MediaTek Dimensity 7050 vs MediaTek Dimensity 7300
Mediatek Helio G99
► remove from comparison
The Mediatek Helio G99 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2022. It is manufactured in a 6 nm FinFET process and is equipped with 2x big ARM Cortex-A76 cores with up to 2.2 GHz and 6x small and power efficient ARM Cortex-A55 cores (max. 2 GHz) in two clusters (bigLITTLE). The chip integrates an ARM Mali-G57 MC2 (two cores). Compared to the older Helio G96, the G99 is manufactured in the more recent 6nm process and clocks higher.
Furthermore, the integrated LTE / 4G modem supports Cat-13 download speeds. Wi-Fi 5 is also integrated (a/b/g/n/ac). The memory controller supportsLPDDR4x with up to 4,266 Mbps.
MediaTek Dimensity 7050
► remove from comparison
The Mediatek Dimensity 7050 (Mediatek MT8791N/TN) is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC integrates two ARM Cortex-A78 cores with up to 2.6 GHz for demanding tasks and six power-saving ARM Cortex-A55 cores with clock rates of up to 2 GHz. The specifications are identical to the old Dimensity 1080.
The chip has an integrated sub-6 GHz 5G modem including dual-SIM support that can reach a maximum download speed of up to 2.77 Gbit/s. Wi-Fi 6 (802.11ax) is supported as well as Bluetooth 5.2.
The memory controller copes with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the ARM Mali-G68 MC4, which supports displays with 120 Hz as well as HDR10+ at a maximum resolution of 2,520 x 1,440 pixels.
The MediaTek Dimensity 7050 is still manufactured in 6 nm.
MediaTek Dimensity 7300
► remove from comparison
The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
| Model | Mediatek Helio G99 | MediaTek Dimensity 7050 | MediaTek Dimensity 7300 | ||||||||||||||||||||
| Codename | Cortex-A76 / A55 | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||||||||||||||
| Series | Mediatek Mediatek Helio G | ||||||||||||||||||||||
| Series: Mediatek Helio G Cortex-A76 / A55 |
| ||||||||||||||||||||||
| Clock | 2000 - 2200 MHz | 2000 - 2600 MHz | 2000 - 2500 MHz | ||||||||||||||||||||
| Cores / Threads | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | 8 / 8 4 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | ||||||||||||||||||||
| Technology | 6 nm | 6 nm | 4 nm | ||||||||||||||||||||
| Features | 2x Cortex-A76, 6x Cortex-A55, 4G LTE Cat-12/13, 64MP AI-Camera support, LPDDR3/LPDDR4x-2133, eMMC 5.1, UFS 2.1, Beidou, Galileo, Glonass, GPS, Wi-Fi 5 (a/b/g/n/ac), AI Accelerator up to 1 TMACs, H.264 / H.265 / HEVC video encoding (4k30) | 2x ARM Cortex-A78 (2.6 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G68 MC4, 5G NR Sub-6 GHz, LTE | |||||||||||||||||||||
| iGPU | ARM Mali-G57 MP2 | ARM Mali-G68 MP4 | ARM Mali-G615 MP2 | ||||||||||||||||||||
| Architecture | ARM | ARM | ARM | ||||||||||||||||||||
| Announced | |||||||||||||||||||||||
| Manufacturer | www.mediatek.com | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks Mediatek Helio G99 → 100% n=20
Average Benchmarks MediaTek Dimensity 7050 → 125% n=20
Average Benchmarks MediaTek Dimensity 7300 → 136% n=20
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
