Qualcomm Snapdragon 625 vs HiSilicon Kirin 710A vs HiSilicon Kirin 960s

Qualcomm Snapdragon 625

The Qualcomm Snapdragon 625 (SD625) is a mid-range octa-core SoC with eight ARM Cortex-A53 cpu cores at up to 2 GHz, an Adreno 506 GPU, a DDR3L-1866 memory controller and a X9 LTE (Cat 7, 4G+, 300 Mbps down, 150 Mbps up) modem. Furthermore, the chip supports 802.11ac WiFi and Bluetooth 4.1. It is manufactured in 14nm FinFet. The processor performance should be similar to a HiSilicon Kirin 650, which also offers 8 Cortex A53 cores at up to 2 GHz. However, due to the modern manufacturing process, power consumption and throttling should be better with the Snapdragon 625.

HiSilicon Kirin 710A

The HiSilicon Kirin 710A is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It is based on the Kirin 710, but manufactured in 14nm FinFET at SMIC (China) versus the TSMC in 12nm. It was announced mid 2020 and contains 8 processor cores (4x Cortex-A73 at up to 2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

HiSilicon Kirin 960s

The HiSilicon Kirin 960S is an ARM based mid-range octa-core SoC for smartphones and tablets, which was introduced with the 2018 10.5-inch Huawei MediaPad M5. Compared to the normal Kirin 960, the 960S offers an additional NPU for AI calculations from the Kirin 970. Looks like to be slower clocked than the older Kirin 960.

Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G71 MP8 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE Cat. 12/13 modem. It is one of the fastest ARM SoCs in the end of 2016. The Kirin 960 is manufactured in a modern 16-nm process at TSMC.