MediaTek's new Filogic chipsets are slated to bring Wi-Fi 6 or 6E to next-gen mobile and smart devices
MediaTek has already established itself as a market leader in electronic components, not to mention its SoCs for fully-functional mobile and portable devices. Now, it has expanded its range further with the new Filogic series for Wi-Fi 6 or 6E connectivity.
This new line has kicked off with the launch of its inaugural members. The 630 is a chipset intended for compatibility with interfaces that include PCIe, and is rated for both Wi-Fi 6 and 6E. It has a 5/6GHz system for the 3T3R (3x3) antenna type, which involves integrated front-end modules (FEMs) and, thus, compete effectively with older, discrete-FEM 2T2R set-ups.
MediaTek also asserts that the 630's extra antenna support makes for "superior transmit beamforming". Furthermore, it combines a reduced radio-frequency frontend (RFFE) surface area with this novel integration for a smaller footprint and a reduced bill of materials, which may allow an OEM to design a thinner, lighter and potentially more cost-effective device.A
Accordingly, MediaTek asserts that the Filogic 630 can be combined with the 830 for powerful tri-band (2x2 2.4GHz and 3x3 5 to 6GHz) Wi-Fi specs. This new 12nm dedicated dual 4x4 Wi-Fi 6/6E SoC is made of quad ARM Cortex-A53 cores at up to 2GHz to deliver up to 6Gb/s speeds. It is also rated to support dual 2.5G Ethernet ports, among other inputs.
This nascent Filogic series is Wi-Fi Alliance EasyMesh certified, and also features its OEM's FastPath technology for reduced latency in tasks such as gaming or augmented/virtual reality (AR/VR) applications. It is now pitched at a range of use-cases, inlcuding integration in the laptops, NAS products or smart TVs of the near future, not to mention next-gen routers, smart speakers, broadband CPEs, security cameras and even edge devices.