MediaTek Dimensity 6100 Plus launches to bring "advanced" 5G and display specs to the masses

MediaTek's latest SoC offering is a Plus variant of the new Dimensity 6000 series, which slots in under the 7000 and 8000 tiers in turn to "enhance the next generation of mainstream 5G devices".  Accordingly, the 6100+ is rated to make "advanced (albeit seemingly sub-6GHz only) connectivity more accessible", not to mention up to "20% reduced power consumption" thanks to UltraSave 3.0+ technology.

Nevertheless, MediaTek cannot disguise the fact that this selling point can be delivered with recycled silicon in 2023, as the 6100+ is all too reminiscent of existing low- to mid-tier Dimensity processors with a well-worn 2 x ARM Cortex-A76 and 6 x Cortex-A55 core configuration.

The OEM could have been more forthright with the ominous similarity to chipsets like the 700-day-old Dimensity 810 by specifying the 6100+'s architecture or GPU - however, it has done neither in the 'new' SoC's launch announcement, other than to tout the latter as "outstanding".

Nevertheless, we do know that these graphics can drive 90-120Hz displays with "premium" 10-bit color support. The 6100+'s (also anonymous) ISP is compatible with "AI camera" features, particularly bokeh, through up to 108MP sensors, although their video resolution will be capped at 2K/30fps.

MediaTek projects that the first Dimensity 6100+-powered smartphone will be released by the end of the third quarter of 2023 (2Q2023).

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