Xiaomi and MediaTek collaborate to deliver new Dimensity 8200 Ultra chipset in CIVI 3
Xiaomi is preparing to release the CIVI 3, less than a year after introducing the CIVI 2 in China. Incidentally, the CIVI 2 recently arrived globally as the Xiaomi 13 Lite, albeit with different ultra-wide-angle and secondary front-facing cameras. Nonetheless, Xiaomi is teasing the CIVI 3 as the first smartphone with a new MediaTek Dimensity chipset.
As the images below show, Xiaomi has based the CIVI 3 on the Dimensity 8200 Ultra. For reference, the CIVI 3 will be the first in the series to rely on a MediaTek chipset; previously, Xiaomi integrated the Snapdragon 778G, Snapdragon 778G Plus and the Snapdragon 7 Gen 1 in CIVI handsets. While neither MediaTek nor Xiaomi has provided any details about the Dimensity 8200 Ultra yet, GSMArena expects it to be an overclocked version of the existing Dimensity 8200.
In any case, Xiaomi has teased that the Dimensity 8200 Ultra will also feature an improved image signal processor (ISP). Purportedly, MediaTek has managed to reduce power consumption and shutter lag, although it remains to be seen how these will affect real-world usage. Moreover, the Dimensity 8200 Ultra will support 30 new video features. The CIVI 3 will put the refined ISP to use with what appears to be two rear-facing cameras, the primary of which is rumoured to be the Sony IMX800. For context, the Sony IMX800 is a 54 MP and 1/1.49-inch sensor that is already available in the Honor 70.
