The Honor Magic 8 series was released earlier this month in China. The series currently consists of the standard Magic 8 and the Magic 8 Pro. However, the series may launch additional models. The predecessor Magic 7 series included an RSR Porsche Design model. However, the Magic 8 series is rumored to introduce a new 'Ultra' model, replacing the RSR Porsche Design.
A new leak from tipster Digital Chat Station hints at specifications for an upcoming flagship model, which GSMArena reports is likely the Magic 8 Ultra. According to the tipster, the upcoming phone may feature a 6.71-inch LTPO OLED quad-curved display with a 1.5K resolution. This is smaller than the Magic 7 RSR Porsche Design, which featured a 6.8-inch panel.
Just like the vanilla Magic 8 and the Magic 8 Pro, the Ultra model is also tipped to use the Snapdragon 8 Elite Gen 5 processor. It is Qualcomm's current flagship octa-core chipset fabricated on a 3nm N3P process node.
The previous leak suggested that the Magic 8 Ultra may use an OmniVision primary sensor; however, the exact model was not revealed. According to the new leak, it will be the 50MP OmniVision OV50R sensor featuring high dynamic range. According to OmniVision's official website, the said camera sensor will be mass-produced in Q1 2026. The Magic 8 Ultra may therefore hit the shelves sometime next year. The phone was previously tipped to feature a 200MP periscope telephoto lens.
The Honor's upcoming phone may feature a battery in the 7,000mAh range. For reference, the Magic 8 Pro uses a 7,200mAh battery. Finally, the tipster suggests that the Magic 8 Ultra will offer an ultrasonic fingerprint sensor and 3D facial recognition for biometrics. Do note that this information is unconfirmed, so take it with a grain of salt.
Source(s)
数码闲聊站 on Weibo (in Chinese) via GSMArena












