Ayaneo details VC liquid cooling system for its upcoming Flip handheld consoles
The Flip KB / DS handheld consoles are now up for pre-orders via a crowdfunding campaign on Indiegogo and Ayaneo unveiled a few more specs including an upgraded cooling system that could become standard for all models moving forward. The new cooling system was teased in a Youtube video by the company’s CEO Arthur Zhang a few weeks ago, but the recently added Indiegogo slides reveal additional info.
Arthur Zhang mentioned that Ayaneo is probably the first to integrate the vapor chamber heat dissipation system in handheld consoles. This type of cooling system is usually found on premium laptops and mobile phones, but Ayaneo decided to adopt it in order to squeeze as much performance as possible from the AMD Phoenix and Hawk Point processors that run at a maximum of 28 W. Zhang explains that the traditional copper heatpipes system was not allowing the AMD APUs to perform at max speed with low enough temperatures, so the VC system was chosen instead. Moreover, the production costs for the VC system is considerably higher compared to copper heatpipes, yet this is barely reflected in the unit price.
Considering the limited volume of the handheld’s chassis, Ayaneo’s VC plate measures 6243 mm2 with a heat dissipation fin area of 27189 mm2, which is right in between the size of a laptop VC and that of a phone VC. The designers also made sure that the air vents do not hinder access to important ports like the TF card reader slot.
The Indiegogo campaign will run for 61 more days and shipping for the Flip KB / DS consoles is expected to begin sometime in March.
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