Intel Core i5-13420H vs Intel Core i7-7567U vs Intel Celeron 3965U

Intel Core i5-13420H

The Intel Core i5-13420H is a mid-range mobile CPU for laptops based on the Raptor Lake-H series (Alder Lake architecture). It was announced in early 2023 and offers 4 of the 6 performance cores (P-cores, Golden Cove architecture) and 4 of the 8 efficient cores (E-cores, Gracemont architecture). The P-cores support Hyper-Threading leading to 16 supported threads when combined with the E-cores. The clock rate ranges from 2.1 to 4.6 GHz (single core boost, all core up to 4.5 GHz) on the performance cluster and 1.5 to 3.4 GHz on the efficient cluster. The performance of the E-cores should be similar to old Skylake cores (compare to the Core i7-6700HQ). All cores can use up to 12 MB L3 cache. 

Performance

Thanks to the higher clock speeds of the improved Intel 7 process, the Core i5-13420H can surpass the old Core i5-12450H (e.g., + 200 MHz boost).

Features

The integrated memory controller supports various memory types up to DDR5-5200 (up from DDR5-4800 of the i5-12500H). The Thread Director (in hardware) can support the operating system to decide which thread to use on the performance or efficient cores for the best performance. For AI tasks, the CPU also integrates GNA 3.0 and DL Boost (via AVX2). Quick Sync in version 8 is the same as in the Rocket Lake CPUs and supports MPEG-2, AVC, VC-1 decode, JPEG, VP8 decode, VP9, HEVC, and AV1 decode in hardware. The CPU now supports PCIe 5.0 x8 for a GPU and two PCIe 4.0 x4 for SSDs.

The integrated graphics card is based on the Xe-architecture and offers 48 of the 96 EUs (Execution Units).

The CPU is rated at 45 W base power (115 W PL2) but most laptops will use a PL1 of around 60 Watt. The SoC is manufactured in a further improved 10nm process at Intel, which is known as Intel 7.

Intel Core i7-7567U

The Intel Core i7-7567U is a fast dual-core SoC for notebooks based on the Kaby Lake architecture and was announced in January 2017. The CPU has two processor cores clocked at 3.5-4 GHz (two cores up to 3.9 GHz). The processor can execute up to four threads simultaneously thanks to Hyper Threading. It is also equipped with an Intel Iris Plus Graphics 650 GPU with 64 MB eDRAM, a dual-channel memory controller (DDR4) as well as VP9 and H.265 video decoding as well as encoding. The chip is still manufactured in a 14nm process with FinFET transistors.

Compared to the Core i7-7560, the 7567U has a higher TDP of 28 vs. 15 Watts as well as higher clocks.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Thanks to the high clocks pf up to 4 GHz and 64 MB eDRAM (can also be used as L4 cache by the CPU), the Core i7-7567U is the fastest dual-core for notebooks in the beginning of 2017. It competes with lower clocked quad-core models and can convince by the excellent single-thread performance. Some games might require a real quad-core though and could not run perfectly on the dual-core, despite Hyper Threading.

Graphics

The integrated Intel Iris Plus 650 Graphics is the GT3e model of the Kaby Lake GPU (Intel Gen. 9.5). It has 48 Execution Units running at 300-1100 MHz and the performance is comparable to a GeForce 920MX thanks to fast eDRAM cache. However, there aren't any significant improvements compared to the old Iris Pro 550, so modern games can often not be played smoothly or only at the lowest or medium settings, respectively.

Contrary to Skylake, Kaby lake now also supports H.265/HEVC Main 10 with a 10-bit color depth as well as Google's VP9 codec. The dual-core Kaby Lake processors announced in January should also support HDCP 2.2.

Power Consumption

The chip is manufactured in an improved 14nm process with FinFET transistors, which improves the efficiency even further. Intel specifies the TDP with 28 Watts, which can be reduced to 23 Watts (cTDP Down) depending on the usage scenario. The TDP is pretty high compared to the common 15-Watt TDP for dual-core processors, but allows a better utilization of CPU and GPU Turbo.

Intel Celeron 3965U

The Intel Celeron 3965U is an ULV (ultra low voltage) dual-core SoC based on the Kaby-Lake architecture and has been launched in the first quarter of 2017. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores without Hyper-Threading clocked at 2.2 GHz (no Turbo Boost), the chip also integrates an HD Graphics 610 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Architecture

Intel basically uses the same micro architecture compared to Skylake, so the per-MHz performance does not differ. The manufacturer only reworked the Speed Shift technology for faster dynamic adjustments of voltages and clocks, and the improved 14nm process allows much higher frequencies combined with better efficiency than before.

Performance

Due to the missing Turbo Boost and the low clock speeds, especially the single thread performance is very limited which results in a lower performance even for lower demanding tasks. The performance should be between the Intel Pentium 4405U and 4415U. Still, the CPU has sufficient power for office and multimedia purposes.

Graphics

The integrated graphics unit called HD Graphics 610 (similar to the HD Graphics 510) represents the "GT1" version of the Kaby Lake GPU (Intel Gen. 9). Its 12 Execution Units, also called EUs, are clocked at 300 - 900 MHz and offer a performance somewhat below the older HD Graphics 4400. Only a few games of 2015 can be played smoothly in lowest settings.

Power Consumption

Specified at a TDP of 15 W (including CPU, GPU and memory controller), the CPU is best suited for small notebooks and ultrabooks (11-inches and above). Optionally, the TDP can be lowered to 10 watts (cTDP down), reducing both heat dissipation and performance and allowing even more compact designs.