Honor Magic V6: Leak reveals key details of next-gen foldable phone ahead of global debut

The Honor Magic V6 is the company's upcoming flagship foldable smartphone, succeeding last year's Magic V5. A leak from tipster Experience more on the Chinese social media platform Weibo reveals the key specifications of the device.

The leak reveals 'About device' screenshots for two variants: a standard version with model number PNM-AN10 and a version with Beidou satellite connectivity with model number PNM-AN20. The key difference between the two versions is battery capacity. While the standard version comes with a 6,850mAh battery, the satellite version has a larger 7,150mAh battery (20K Anker powerbank curr. $50 on Amazon).

The screenshots also show the standard version with 16GB of RAM and 512GB of storage, and the satellite variant with 12GB of RAM and 256GB of storage, though additional configurations are expected.

The leak suggests the Honor Magic V6 will feature an inner display with a resolution of 2352 × 2172 pixels and an outer display with a resolution of 2420 × 1080 pixels.

The Magic V6 is expected to use the Snapdragon 8 Elite Gen 5, Qualcomm's latest flagship processor. Notably, the leak also suggests the Magic V6 to feature in-house custom chips, including the C1+ and E2. The Honor C1+ is an in-house RF (radio frequency) enhancement chip designed to improve wireless connectivity, while the Honor E2 is a dedicated power-enhancement chip.

In terms of software, the Magic V6 is expected to run MagicOS 10 based on Android 16. More information should become available when the phone launches globally on March 1.