Samsung Exynos 2400 tipped for mass production with cutting-edge semiconductor technology

GDDR6W launched in 2022 touted as a new kind of extra-high-performance VRAM due to the way it had been made. It is the first semiconductor product from Samsung made using the fan-out wafer-level packaging (FOWLP) technique and, thus, backed to get more bandwidth and capacity than a GDDR6X module of similar size.

The FOWLP process allows individual chips to integrate over a wafer of silicon rather than through the medium of a PCB. Accordingly, a GDDR6W module is rated to be 36% "shorter" than a GDDR6X counterpart at only 0.7 microns (μm) in height, even though the former is estimated to be up to 30% faster.

Now, this packaging technology is coming to processors, starting with the Exynos series, according to well-known leaker @Tech_Reve. Mass production for these supposedly advanced chips might begin in "the fourth quarter" (presumably of 2023), raising suspicion that these first-gen FOWLP chips could include the new 2400 allegedly destined for the Galaxy S24 and S24 Plus.

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