Mediatek Helio G99 vs MediaTek Dimensity 800U vs MediaTek Dimensity 720
Mediatek Helio G99
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The Mediatek Helio G99 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2022. It is manufactured in a 6 nm FinFET process and is equipped with 2x big ARM Cortex-A76 cores with up to 2.2 GHz and 6x small and power efficient ARM Cortex-A55 cores (max. 2 GHz) in two clusters (bigLITTLE). The chip integrates an ARM Mali-G57 MC2 (two cores). Compared to the older Helio G96, the G99 is manufactured in the more recent 6nm process and clocks higher.
Furthermore, the integrated LTE / 4G modem supports Cat-13 download speeds. Wi-Fi 5 is also integrated (a/b/g/n/ac). The memory controller supportsLPDDR4x with up to 4,266 Mbps.
MediaTek Dimensity 800U
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The Mediatek Dimensity 800U is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 3 core ARM Mali-G57 MC3 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
Compared to the Dimensity 820, the 800U offers lower clocked A76 cores and a slower GPU.
The Dimensity 800U is manufactured in the modern 7nm process and should be very power efficient.
MediaTek Dimensity 720
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The Mediatek Dimensity 720 is a mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores and four power efficient Cortex-A55 cores, all clocked at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 3 core ARM Mali-G57 MC3 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU) and video de- and encoding. Compared to the faster Dimensity 820, the CPU cores are lower clocked and the GPU offers less cores. Furthermore, all other features were slightly restricted (e.g. max. 12 GB RAM).
The Dimensity 720 is manufactured in the modern 7nm process and should be very power efficient.
Model | Mediatek Helio G99 | MediaTek Dimensity 800U | MediaTek Dimensity 720 | ||||||||||||||||||||
Codename | Cortex-A76 / A55 | Cortex-A76 / A55 | Cortex-A76 / A55 | ||||||||||||||||||||
Series | Mediatek Mediatek Helio G | ||||||||||||||||||||||
Series: Mediatek Helio G Cortex-A76 / A55 |
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Clock | 2000 - 2200 MHz | 2000 - 2400 MHz | 2000 MHz | ||||||||||||||||||||
Cores / Threads | 8 / 8 2 x 2.2 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | 8 / 8 | ||||||||||||||||||||
Technology | 6 nm | 7 nm | 7 nm | ||||||||||||||||||||
Features | 2x Cortex-A76, 6x Cortex-A55, 4G LTE Cat-12/13, 64MP AI-Camera support, LPDDR3/LPDDR4x-2133, eMMC 5.1, UFS 2.1, Beidou, Galileo, Glonass, GPS, Wi-Fi 5 (a/b/g/n/ac), AI Accelerator up to 1 TMACs, H.264 / H.265 / HEVC video encoding (4k30) | 2x ARM Cortex-A76 (2.4 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G75 MC5, APU 3.0, 5G Modem (2CC), MiraVision (4K HDR Video, 80MP Photo), Wi-Fi 5, Bluetooth 5.1, UFS 2.2, 16GB LPDDR4x Support | 4x ARM Cortex-A76 (2 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G57 MC3, APU 3.0, 5G Modem, MiraVision (4K30 Video, 64MP Photo), Wi-Fi 5, Bluetooth 5.1, UFS 2.2, 12GB LPDDR4x Support | ||||||||||||||||||||
iGPU | ARM Mali-G57 MP2 | ARM Mali-G57 MP3 | ARM Mali-G57 MP3 | ||||||||||||||||||||
Architecture | ARM | ARM | ARM | ||||||||||||||||||||
Announced | |||||||||||||||||||||||
Manufacturer | www.mediatek.com | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks Mediatek Helio G99 → 100% n=13
Average Benchmarks MediaTek Dimensity 800U → 72% n=13
Average Benchmarks MediaTek Dimensity 720 → 81% n=13

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation