Intel Core i3-2375M vs Intel Core 2 Duo T6770 vs Intel Core 2 Duo P8400
Intel Core i3-2375M
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The Intel Core i3-2375M is a power efficient ULV (Ultra Low Voltage) processor for thin and light laptops. The base frequency of 1.5 GHz is relatively low and the CPU does not support Turbo Boost for automatic overclocking. Due to HyperThreading, the i7-2375M is able to handle 4 threads in parallel. Compared to similar clocked Celeron and Pentium models, the i3 features the faster HD 3000 graphics card and offers more enabled features (like Quick Sync). However, compared to the expensive i7 CPUs, the i3 lacks VT-d, Trusted Execution and VPro support. The difference to the similar Core i3-2377M is just the lack of Small Business Advantage (SBA) support (needed for the Ultrabook logo).
Sandy Bridge is the evolutionary successor of the Arrandale architecture. The most notable improvements is the improved Turbo 2.0 (not used for the processing cores in the i3-2375M) and the integration of the graphics card into the 32nm CPU core.
The integrated Intel HD Graphics 3000 is clocked at 350 up to 1000 MHz (Turbo Boost). Due to the slower clock rate without the Turbo, compared to HD Graphics 3000 in 35W and 45W processors (usually clocked at 650 base speed in non LV processors), the performance is noticeable lower.
The performance of the CPU is a bit higher than a similar clocked Arrandale Core i3 ULV and therefore above the 1.33 GHz Core i3-380UM. The average performance of the CPU part is therefore similar to the AMD A4-3320M. Detailed benchmarks can also be found on the CPU page of the Core i3-2377M.
The TDP of 17W (includes the integrated GPU and memory controller) allows the use of the 2375M CPU in small subnotebooks.
Intel Core 2 Duo T6770
► remove from comparisonThe Intel Core 2 Duo T6670 is a laptop processor based on the Penryn core. It offers only 2 MB level 2 cache and is therefore slower than other 2.3 GHz clocked Core 2 Duo CPUs.
Intel Core 2 Duo P8400
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The Intel Core 2 Duo P8400 is a dual core processor for laptops. It features 2.26 GHz and a shared level 2 cache of 3 MB. Due to the smaller cache (Core 2 Duo T-Models got usually 6 MB at this clock rate), the TDP is only 25 Watt (instead of the 35 Watt of the T-models).
The performance of the P8400 is on par with the fast Turion II Ultra with about 2.4 to 2.6 GHz. Modern demanding games like Supreme Commander may be limited by the CPU performance. High end gamers should choose a higher clocked Core 2 Duo (or Core i5 / i7).
The P8400 uses a Penryn (Montevina Update) core that features 2 integer units, 1 floating point unit, 1 load unit, and 1 store unit in a 14-stages long pipeline. Due to the Wide Dynamic Execution Technology, the core is able to simultaneously execute up to four instructions.
The integrated Enhanced Speedstep is able to downclock the core dynamically as low as 800 MHz to save power (in idle mode).
The Core 2 Duo P8400 can be used in a Socket P socket with 479 pins: Socket P / Micro Flip-Chip Pin Grid Array (Micro-FCPGA) requires 479-pin surface mount Zero Insertion Force (ZIF) socket (mPGA479M socket) or Micro Flip-Chip Ball Grid Array (Micro-FCBGA) for surface mount (479-ball)
Model | Intel Core i3-2375M | Intel Core 2 Duo T6770 | Intel Core 2 Duo P8400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Sandy Bridge | Penryn | Penryn | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Intel Core i3 | Intel Core 2 Duo | Intel Core 2 Duo | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Core 2 Duo Penryn |
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Clock | 1500 MHz | 2300 MHz | 2260 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||
L1 Cache | 128 KB | 128 KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
L2 Cache | 512 KB | 2 MB | 3 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||
L3 Cache | 3 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 2 / 4 | 2 / 2 | 2 / 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
TDP | 17 Watt | 35 Watt | 25 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Transistors | 624 Million | 410 Million | |||||||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 32 nm | 45 nm | 45 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
Die Size | 149 mm2 | 107 mm2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
max. Temp. | 100 °C | 105 °C | |||||||||||||||||||||||||||||||||||||||||||||||||||||
Socket | FCBGA1023 | Socket P | |||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | HD Graphics 3000 (350-1000MHz), DDR3-1066/1333 Memory Controller (max 8GB), HyperThreading, AVX, Quick Sync, Virtualization | SSE4.1, Virtualization Technology, Execute Disable Bit, Enhanced Speedstep, Ehnaced Halt State (C1E), 64 Bit, Trusted Execution Technology | |||||||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | Intel HD Graphics 3000 (350 - 1000 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | x86 | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
$250 U.S. | $209 U.S. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
Announced | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | ark.intel.com | ark.intel.com | |||||||||||||||||||||||||||||||||||||||||||||||||||||
FSB | 800 | 1066 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
Voltage | 1.05-1.15 V |
Benchmarks
Average Benchmarks Intel Core i3-2375M → 0% n=0
Average Benchmarks Intel Core 2 Duo P8400 → 0% n=0

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation