XRing O1 officially announced as Xiaomi's new self-developed smartphone SoC
Update: According to a new report by Reuters, Xring O1 will actually be built on TSMC's 3nm node, not a 4nm one as recent leaks have claimed.
--------------------------------------------------------------
After months of leaks and rumors, Chinese smartphone maker Xiaomi has finally announced the imminent launch of its new self-developed smartphone chipset. This new SoC has been officially confirmed to be branded as "XRING O1".
Taking to his official Weibo handle today, Xiaomi CEO Lei Jun confirmed the company's plans to release XRing O1 this month. In late May, to be exact, which also happens to be consistent with our previous reports on the matter.
While the company has released no further information on XRing O1, recent leaks indicate the chipset will be built on TSMC's 4nm process, and will feature a 1+3+4 core setup, with a prime core running at 3.2 GHz, three performance cores at 2.5 GHz, and four efficiency-focused cores at 2.0 GHz. The identity of those cores are unknown, however, and there's a chance the final product also differs.
According to Digital Chat Station, XRing O1 will deliver impressive performance but not on the level of current-gen flagship chipsets like the Snapdragon 8 Elite and Dimensity 9400 series. A previous leak also claimed the Xiaomi chipset could perform in the same ballpark as the Snapdragon 8 Gen 2. That will likely be considered a success considering the XRing O1 launches as Xiaomi's first in-house chipset since the Surge S1 in 2017.
Source(s)
